<h2>訂單滿滿：這家先進封裝製造商的訂單延續多年，因為人工智能熱潮對材料的需求超過了行業產能</h2>
<p>辛耘科技（Scientech Corp）專注於提供先進封裝設備和再生晶圓，預計到 2028 年將有清晰的訂單可見性，受益於對用於生產人工智能（AI）芯片的芯片製造設備的爆炸性需求。</p>
<p>該公司表示，再生晶圓主要用於監測、測試和校準半導體設備，而不是用於實際芯片的生產，辛耘科技分銷用於光刻、蝕刻、薄膜工藝的其他品牌的半導體制造設備。</p>
<p>辛耘科技週三表示，已預訂高達 130 億新台幣（約合 4.15 億美元）的合同負債，表明客户需求旺盛，未來幾年有潛在的收入增長，因其已收到預付款。</p>
<p>該公司的增長動力來自於對用於生產 AI 芯片和高性能計算（HPC）設備的先進芯片封裝設備的強勁需求。</p>
<p>這導致設備交付週期縮短至約 8 到 12 個月，而類似設備的平均交付週期為 4 到 6 個月。</p>
<p>“我們自有品牌的產能今年已被完全預訂。我們正在為明年和後年做準備，” 辛耘科技副董事長許明棋在台北的媒體聚會上告訴記者。“客户對用於 AI 和 HPC 相關應用的先進封裝設備的需求非常強勁。我們無法跟上他們的步伐。”</p>
<p>該公司表示，半導體行業的增長速度 “令人震驚”，這是前所未見的。全球半導體行業預計今年將產生 1 萬億美元的收入，早於大多數行業研究機構估計的 2030 或 2031 年。</p>
<p>為了滿足客户需求，辛耘科技正在新建工廠，以擴大位於新竹縣湖口鄉和台南的先進封裝設備和再生晶圓的產能。到 2028 年，該公司將使自有品牌設備的產能翻倍。</p>
<p>強勁的增長勢頭預計將使其自有品牌設備和再生晶圓的收入佔比在今年超過 50%，而過去幾年為 40%。</p>
<p>該公司計劃在明年上半年在美國設立新的銷售和服務辦公室，以滿足客户需求，並與主要客户在亞利桑那州的新先進封裝廠建設保持一致。</p>
<p>辛耘科技去年的收入同比增長 17.37%，達到 113.7 億新台幣，首次超過 100 億新台幣，創下歷史新高。</p>

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費城交易所 半導體 ETF - iShares

半導體 ETF - VanEck Vectors

STAI

<p>Scientech Corp 已獲得訂單，延續至 2028 年，受益於對人工智能芯片製造設備的強勁需求。該公司報告的合同負債為 130 億新台幣，顯示出客户的強烈興趣和潛在的收入增長。由於交貨週期目前為 8-12 個月，Scientech 正在擴大其在新竹和台南的生產能力。半導體行業預計今年將達到 1 萬億美元，這促使 Scientech 增強其設備產能，並在美國建立新的銷售辦公室以支持客户需求</p>

<h2>BOOKED SOLID: The advanced packaging manufacturer has orders stretching out for years as the AI boom’s ravenous demand for material outstrips industry capacity</h2>
<div class="lb-trans"><h2>訂單滿滿：這家先進封裝製造商的訂單延續多年，因為人工智能熱潮對材料的需求超過了行業產能</h2>
</div><p>Scientech Corp (辛耘), which specializes in supplying advanced packaging equipment and reclaimed wafers, has clear order visibility through 2028, benefiting from explosive demand for chip manufacturing equipment used to produce artificial intelligence (AI) chips.</p>
<div class="lb-trans"><p>辛耘科技（Scientech Corp）專注於提供先進封裝設備和再生晶圓，預計到 2028 年將有清晰的訂單可見性，受益於對用於生產人工智能（AI）芯片的芯片製造設備的爆炸性需求。</p>
</div><p>Reclaimed wafers are primarily used for monitoring, testing and calibrating semiconductor equipment rather than producing actual chips, said the company, which distributes semiconductor manufacturing equipment used in lithography, etching, thin-film processes from other brands.</p>
<div class="lb-trans"><p>該公司表示，再生晶圓主要用於監測、測試和校準半導體設備，而不是用於實際芯片的生產，辛耘科技分銷用於光刻、蝕刻、薄膜工藝的其他品牌的半導體制造設備。</p>
</div><p>Scientech on Wednesday said it booked as much as NT$13 billion (US$415 million) in contract liabilities, indicating brisk customer demand and potential revenue growth for the next few years after receiving advanced payments.</p>
<div class="lb-trans"><p>辛耘科技週三表示，已預訂高達 130 億新台幣（約合 4.15 億美元）的合同負債，表明客户需求旺盛，未來幾年有潛在的收入增長，因其已收到預付款。</p>
</div><p>The growth momentum is fueled by strong demand for advanced chip packaging equipment used in the production of AI chips and high-performance computing (HPC) devices, the company said.</p>
<div class="lb-trans"><p>該公司的增長動力來自於對用於生產 AI 芯片和高性能計算（HPC）設備的先進芯片封裝設備的強勁需求。</p>
</div><p>That has led to telescoping equipment delivery lead time to about eight to 12 months, it said. That is longer than an average delivery period of between four and six months for similar equipment.</p>
<div class="lb-trans"><p>這導致設備交付週期縮短至約 8 到 12 個月，而類似設備的平均交付週期為 4 到 6 個月。</p>
</div><p>“Our own-brand capacity has been fully booked this year. We are preparing for next year and the year after,” Scientech vice chairman M.T. Hsu (許明棋) told reporters at a media gathering in Taipei. “Customers’ demand for advanced packaging equipment used in AI and HPC-related applications is very strong. We cannot catch up with their pace.”</p>
<div class="lb-trans"><p>“我們自有品牌的產能今年已被完全預訂。我們正在為明年和後年做準備，” 辛耘科技副董事長許明棋在台北的媒體聚會上告訴記者。“客户對用於 AI 和 HPC 相關應用的先進封裝設備的需求非常強勁。我們無法跟上他們的步伐。”</p>
</div><p>The semiconductor industry is growing at such an “overwhelming” pace, which has not previously been seen, the company said. The global semiconductor industry is likely to generate US$1 trillion this year, earlier than the 2030 or 2031 mark estimated by most industry research houses, it said.</p>
<div class="lb-trans"><p>該公司表示，半導體行業的增長速度 “令人震驚”，這是前所未見的。全球半導體行業預計今年將產生 1 萬億美元的收入，早於大多數行業研究機構估計的 2030 或 2031 年。</p>
</div><p>To meet customer demand, Scientech is building new factories to expand advanced packaging equipment and reclaimed wafers capacity in Hsinchu County’s Hukou Township (湖口) and in Tainan. By 2028, the company would double its own-brand equipment capacity, it said.</p>
<div class="lb-trans"><p>為了滿足客户需求，辛耘科技正在新建工廠，以擴大位於新竹縣湖口鄉和台南的先進封裝設備和再生晶圓的產能。到 2028 年，該公司將使自有品牌設備的產能翻倍。</p>
</div><p>The strong growth momentum is expected to boost its own-brand equipment and reclaimed wafer revenue share to more than 50 percent of its total revenue this year, compared with 40 percent in the past few years, Scientech said.</p>
<div class="lb-trans"><p>強勁的增長勢頭預計將使其自有品牌設備和再生晶圓的收入佔比在今年超過 50%，而過去幾年為 40%。</p>
</div><p>The company plans to create a new sales and services office in the US by the first half of next year to meet customer demand and align with a major customer’s new advanced packaging fab construction in Arizona, it said.</p>
<div class="lb-trans"><p>該公司計劃在明年上半年在美國設立新的銷售和服務辦公室，以滿足客户需求，並與主要客户在亞利桑那州的新先進封裝廠建設保持一致。</p>
</div><p>Scientech’s revenue last year grew 17.37 percent year-on-year to NT$11.37 billion, surpassing NT$10 billion for the first time and setting an all-time high.</p>
<div class="lb-trans"><p>辛耘科技去年的收入同比增長 17.37%，達到 113.7 億新台幣，首次超過 100 億新台幣，創下歷史新高。</p>
</div>

Scientech 的訂單已排到 2028 年