<div id="readability-page-1"><div id="parent_top_div">Heterogeneous Integration Packaging Solutions Pvt Ltd (3D Glass Solutions) on Sunday kicked off work on India’s first advanced 3D glass chip packaging unit at Info Valley in Bhubaneswar. This is one of the four semiconductor projects approved by the Centre under the India Semiconductor Mission in August 2025. With a proposed investment of around ₹1,943 crore, the unit is expected to place Odisha among emerging global hubs for next-generation chip packaging technology. Once operational, the plant is projected to manufacture about 50 million assembled semiconductor units annually, significantly scaling up India’s chip packaging capacity. Backed by US technology and specialising in 3D Glass Solutions (3DGS), the company is eyeing both domestic and global markets. The project, which will generate more than 2,500 direct and indirect jobs, aims to advance high-performance computing, Artificial Intelligence (AI), and Internet of Things (IoT), marking a major step in India’s semiconductor roadmap. Babu Mandava, president and CEO of 3D Glass Solutions, said packaging is a key component of the semiconductor ecosystem. With advanced technology, the company will build large substrates with high dimensional stability. It specialises in glass-based RF and millimetre-wave packaging substrates. “We are here to build large substrates with high dimensional stability and very high interconnect density, along with very low loss. Our goal is to develop the most sophisticated technology and build an advanced fabrication unit with the highest capacity. This is just the beginning,” he said. Chief Minister Mohan Charan Majhi laid the foundation stone for the project in the presence of Union Electronics and IT Minister Ashwini Vaishnaw, senior officials, industry representatives, investors, and academic leaders. The project is seen as a strategic step in India’s drive to build a domestic semiconductor ecosystem and reduce dependence on imports of critical electronics technologies. Speaking at the event, Majhi said Odisha's industrial landscape is evolving rapidly and is no longer anchored solely in traditional sectors, but is embracing technology, innovation, and high-value manufacturing. “This is a landmark moment as we break ground on India's first advanced 3D glass chip packaging unit. This visionary project will unlock significant employment opportunities and firmly establish Odisha as a serious force in advanced electronics manufacturing,” he said. The Chief Minister added that Odisha is charting a decisive course towards becoming a hub for next-generation industries, contributing to the vision of an Atmanirbhar Bharat. “This project will position Odisha at the forefront of global electronics manufacturing and artificial intelligence, accelerating the state's transformation from a mineral-driven economy to a knowledge-driven one, where the brilliance of Odia talent meets world-class infrastructure. This is not merely an industrial investment; it is a declaration of where the technologies of tomorrow will be built,” he said. Unlike conventional chip assembly units, the Bhubaneswar project will focus on advanced glass substrate packaging and 3D heterogeneous integration technologies, which are regarded as the future of high-performance semiconductor manufacturing. These technologies enable multiple chips, sensors, and components to be stacked or integrated into compact modules that offer faster speeds, lower power consumption, and greater computing efficiency. The facility is expected to produce glass interposers with passive components, silicon bridge solutions, and 3D heterogeneous integration modules. These products are used in high-end sectors including defence electronics, aerospace systems, artificial intelligence computing, RF communications, automotive electronics, photonics, co-packaged optics, and next-generation data centres. Union Minister Ashwini Vaishnaw described the occasion as a historic day for Odisha, saying the state was rapidly diversifying from its traditional minerals-and-metals base into advanced technology sectors such as electronics manufacturing and IT. “The project moved from approval to groundbreaking within months, underlining the fast-track implementation push under the Centre’s semiconductor mission,” he said. The project also gives Odisha a unique distinction. With the upcoming SiCSem compound semiconductor fabrication project and the 3D Glass Solutions packaging facility, Odisha will become the first Indian state to host both a compound semiconductor fab and an advanced glass substrate-based packaging unit.</div></div>

動態半導體 ETF - Invesco

費城交易所 半導體 ETF - iShares

嘉實上證科創板芯片ETF

異構集成封裝解決方案私人有限公司已在布巴內斯瓦爾啓動印度首個先進 3D 玻璃芯片封裝廠的建設，投資額為 1943 億印度盧比。該項目是印度半導體使命的一部分，旨在每年生產 5000 萬個半導體單元，並創造超過 2500 個就業機會。它專注於先進的玻璃基板封裝和 3D 異構集成技術，將奧里薩邦定位為下一代電子製造的中心，並減少對進口的依賴。該項目預計將增強印度的半導體生態系統，並支持高性能計算和人工智能的進步

印度首個先進的 3D 玻璃芯片封裝工廠將在布巴內斯瓦爾建立