Novoray: Advanced packaging rapid penetration drives demand for functional powder materials

On June 6th, at the performance briefing, Li Xiaodong, Chairman and General Manager of Novoray, stated while analyzing the market prospects for spherical silicon that in recent years, demand driven by HPC, AI, high-speed communication, and other sectors is accelerating the development of high-performance packaging materials. According to Yole data, the global advanced packaging market size is approximately USD 43.9 billion in 2023, a year-on-year increase of 19.62%, and it is expected to reach USD 78.6 billion by 2028, with a CAGR of 10.6% from 2022 to 2028, far exceeding the 3.2% of traditional packaging. The rapid penetration of advanced packaging has driven market demand in the fields of EMC, LMC, GMC, Underfill, and other packaging materials, thereby boosting the market demand for inorganic non-metallic functional powder materials such as spherical silica and spherical alumina