StarPower Semiconductor plans to issue convertible bonds to raise no more than 1.5 billion yuan
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According to the announcement from Zhitong Finance APP, StarPower Semiconductor plans to issue convertible corporate bonds to unspecified objects, with a total fundraising amount not exceeding RMB 1.5 billion (including principal). The total fundraising amount, after deducting issuance costs, will be used for: automotive-grade SiCMOSFET module manufacturing project, IPM module manufacturing project, automotive-grade GaN module industrialization project, and working capital supplementation project
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