Taiwan Semiconductor fully raises CoWoS capacity targets for 2026-2027

Taiwan Semiconductor Manufacturing Company (TSMC) will fully increase its CoWoS capacity in the next two years. In addition to NVIDIA becoming its largest customer, ASIC chip clients such as Google are also frequently placing urgent orders to secure capacity. TSMC has recently decided to raise its CoWoS capacity targets for 2026-2027 and is re-evaluating its original advanced packaging expansion plans. According to supply chain sources, TSMC's Nanke AP8 plant will add a new P2 plant, with both plants focusing on CoWoS, while the original Chiayi AP7, which was primarily focused on WMCM, SoIC, and CoPoS, will switch SoIC to CoWoS. (Taiwan Electronic Times)