【New Stock IPO】【Dark Market/Allocation Results】Mainland wireless communication module company MEIG (3268) dark market rose slightly by 1.87%, with a paper profit of HKD 54 per lot

Mainland wireless communication module and solution provider MEIG (3268.HK) will be listed on Tuesday (10th) and will have a dark trading session after the market closes today (9th). According to the three major dark trading venues, MEIG's dark trading reached a high of HKD 29.4, up 1.87% from the offering price of HKD 28.86. Based on a lot size of 100 shares, the maximum paper profit per lot is HKD 54. Dark Trading Venue Latest Dark Price(HKD) Change % Transaction Amount(HKD) Bright Smart 28.9 0.139% 25.6 million Futu 29.4 1.87% 27.2872 million Yau Choi 29 0.49% 670,000 MEIG conducted its IPO from February 27 to March 5, planning to issue 35 million H shares, with 10% allocated for public offering, and the maximum offer price set at HKD 28.86, aiming to raise up to HKD 1.01 billion. The entry fee for one lot of 100 shares is HKD 2,915.1, and it is expected to be listed on March 10, with China International Capital Corporation as the exclusive sponsor. Related Information:【New IPO】Mainland wireless communication module provider MEIG (3268) IPO introduces eight major investors including Japanese company Meiko Electronics, should you subscribe? Background MEIG Technology Co., Ltd. is a provider of wireless communication modules and solutions, focusing on intelligent modules, especially high-performance intelligent modules. The group's modules and solutions are widely used in the Internet of Things, intelligent connected vehicles, and wireless broadband fields. Customized products and solutions provided to customers account for the majority of its revenue. According to data, in 2024, based on revenue from wireless communication module business, the group ranks fourth in the global wireless communication module industry, holding a 6.4% share of the global market. The group's wireless communication module product portfolio includes: intelligent modules, equipped with system-on-chip (SoC) processors and intelligent operating systems, which are further divided into high-performance intelligent modules that focus on supporting complex algorithms and edge AI applications; and conventional intelligent modules that focus on supporting intelligent applications, such as customized software and multimedia functions. Data transmission modules, which emphasize data transmission, security, and high-throughput data exchange