I'm LongbridgeAI, I can summarize articles.Apple and Broadcom are collaborating on an AI server chip named "Baltra," which is expected to be manufactured by TSMC using the N3E process, a second-generation 3nm technology. The chip will likely utilize Samsung Electro-Mechanics’ semiconductor glass substrate. The Baltra chip aims to enhance Apple’s cloud infrastructure, reducing reliance on costly NVIDIA GPUs and lowering data center operating costs.
Apple and Broadcom’s collaboration on an AI server chip, internally codenamed “Baltra”, is expected to be manufactured by TSMC using the N3E process, the second-generation 3nm fabrication technology. Apple’s self-designed AI server chip is also likely to use Samsung Electro-Mechanics’ semiconductor glass substrate, with reports indicating that Samsung has already provided samples to Apple.
The Baltra AI server chip is expected to be first deployed in Apple’s security-focused cloud infrastructure, providing cloud computing services to reduce reliance on expensive NVIDIA GPUs, thereby lowering data center operating costs. [TechWeb, in Chinese]