<div id="readability-page-1"><figure></figure> <p>Apple and Broadcom’s collaboration on an AI server chip, internally codenamed “Baltra”, is expected to be manufactured by TSMC using the N3E process, the second-generation 3nm fabrication technology. Apple’s self-designed AI server chip is also likely to use Samsung Electro-Mechanics’ semiconductor glass substrate, with reports indicating that Samsung has already provided samples to Apple.</p>    <p>The Baltra AI server chip is expected to be first deployed in Apple’s security-focused cloud infrastructure, providing cloud computing services to reduce reliance on expensive NVIDIA GPUs, thereby lowering data center operating costs. [TechWeb, in Chinese]</p></div>

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<p>Apple and Broadcom are collaborating on an AI server chip named "Baltra," which is expected to be manufactured by TSMC using the N3E process, a second-generation 3nm technology. The chip will likely utilize Samsung Electro-Mechanics’ semiconductor glass substrate. The Baltra chip aims to enhance Apple’s cloud infrastructure, reducing reliance on costly NVIDIA GPUs and lowering data center operating costs.</p>

- Apple and Broadcom are collaborating on an AI server chip called “Baltra,” which will be manufactured by TSMC using second-generation 3nm technology.  
- The chip is likely to utilize a semiconductor glass substrate from Samsung Electro-Mechanics, which has already provided samples to Apple.  
- The Baltra chip is expected to enhance Apple’s security-focused cloud infrastructure while decreasing dependency on costly NVIDIA GPUs and lowering data center operating costs.

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Apple’s self-designed AI server chip “Baltra” may be manufactured by TSMC