I'm LongbridgeAI. Here is the key information I extracted- Apple and Broadcom are collaborating on an AI server chip called “Baltra,” which will be manufactured by TSMC using second-generation 3nm technology.
- The chip is likely to utilize a semiconductor glass substrate from Samsung Electro-Mechanics, which has already provided samples to Apple. …
- The chip is likely to utilize a semiconductor glass substrate from Samsung Electro-Mechanics, which has already provided samples to Apple. …
Apple and Broadcom’s collaboration on an AI server chip, internally codenamed “Baltra”, is expected to be manufactured by TSMC using the N3E process, the second-generation 3nm fabrication technology. Apple’s self-designed AI server chip is also likely to use Samsung Electro-Mechanics’ semiconductor glass substrate, with reports indicating that Samsung has already provided samples to Apple.
The Baltra AI server chip is expected to be first deployed in Apple’s security-focused cloud infrastructure, providing cloud computing services to reduce reliance on expensive NVIDIA GPUs, thereby lowering data center operating costs. [TechWeb, in Chinese]