
Sold-Out Capacity: Who Are the Eight Core Bottlenecks for AI's Future Development?

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The race for AI infrastructure has entered a new phase, with core capacities such as TSMC CoWoS and HBM memory chips pre-locked by tech giants like NVIDIA, Apple, Microsoft, and Google until 2027 or 2028. A surge in AI computing demand has exceeded the expansion capacity of the semiconductor supply chain, leading to sold-out production, extended lead times of 6-12 months, and price increases of 10%-30%. Bargaining power within the supply chain is shifting from design to production, highlighting the structural scarcity of AI computing power
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