Four Wall Street Giants Pour $63 Billion into Anthropic Compute, with Broadcom Underwriting Chip Residual Value

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Broadcom has joined hands with multiple financial institutions to structure one of the largest AI chip financing deals to date, reflecting Wall Street's continued bet on artificial intelligence infrastructure construction.

Bank of America, Blackstone, Citigroup, and Morgan Stanley jointly announced on Monday that they would provide a total of $63 billion in financing through a newly established special purpose vehicle (SPV) to purchase Broadcom AI accelerators and networking equipment, and lease them to large AI model developer Anthropic. Chip deliveries are expected to begin in 2027.

The sheer scale and complex structure of this transaction have drawn intense attention from both Wall Street and Silicon Valley. Against the backdrop of headwinds in data center construction and lingering doubts about future AI demand, the market views this deal as a significant endorsement by institutional capital of confidence in AI infrastructure investment.

Meanwhile, Anthropic also filed for an IPO on the same day, reporting a net loss of $80.7 billion in the first half of the year. The company warned that it might not achieve profitability in the future, highlighting an existential "crisis for humanity."

Broadcom shares rose 2.33% on Monday.

Deal Structure: SPV at the Core, Broadcom Providing Backstop

According to statements from all parties, the financing will be executed through a newly established SPV. The funds will be used to acquire Broadcom XPU AI accelerators and network solutions, which will then be provided to Anthropic via leasing.

In terms of financing tranches, Bank of America, Citigroup, and Morgan Stanley are responsible for arranging the senior (first-lien) financing, while Blackstone serves as the sole committed provider for the second-lien tranche.

Broadcom provides "residual value support" to the SPV, with an amount equivalent to the scale of the first-lien financing. This effectively acts as a guarantee to senior creditors; if asset values decline, Broadcom will bear the corresponding losses. The specific scale of the first-lien debt was not disclosed by the parties.

Hock Tan, President and CEO of Broadcom, stated that this transaction validates the market's judgment of sustained growth in AI compute power, confirms the availability of financing capital, and underscores Broadcom's unique position within this ecosystem.

Notably, this transaction is part of the strategic compute agreement previously reached between Broadcom and Anthropic. Prior to this deal, Apollo and Blackstone had already secured financing arrangements for Anthropic's $35 billion compute expansion. The latest $63 billion agreement represents a further expansion on that existing foundation.

Capital Positioning: Banks and Alternative Asset Managers Vie for Entry

The lineup of participants in this transaction clearly outlines Wall Street's strategic positioning in the wave of AI infrastructure financing—traditional banks and alternative asset management firms are working in synergy to fill the massive funding gap in AI compute construction.

As previously reported by Bloomberg, the syndicate assembled by Broadcom on Wall Street had already begun raising approximately $60 billion in AI chip financing for Anthropic and other companies earlier this month, with Bank of America, Citigroup, and Morgan Stanley included. The current deal was finalized after weeks of negotiations.

Jon Gray, President and COO of Blackstone, stated that the rapid growth in AI demand is creating huge opportunities to finance compute power at scale.

Dan Simkowitz, Co-President of Morgan Stanley, said that the bank has been at the forefront of designing scalable capital solutions for AI infrastructure.

Vis Raghavan, Head of Banking at Citigroup, noted that the scale of capital required for AI financing is unprecedented. Citigroup will leverage its global expertise in structured capital markets and distribution to accelerate the construction of critical AI infrastructure.

Jim DeMare, Co-President of Bank of America, emphasized that this transaction combines Broadcom's leading technology with large-scale banking capital to drive the next wave of AI innovation.

Broader Context: AI Infrastructure Financing Scale Continues to Expand

This transaction is the latest footnote in the surge of AI infrastructure financing. Previously, hundreds of billions of dollars in debt capital have flowed into this sector, with a large portion directed toward data center construction. However, specialized financing transactions for chips and servers are also increasing rapidly.

In August this year, NVIDIA announced partnerships with six prominent financial institutions, including Blackstone, planning to mobilize over $500 billion for AI construction and assist customers in securing financing for purchasing its chips.

Broadcom's strategic intent in this transaction is equally clear: to challenge NVIDIA head-on by expanding sales of AI chips and data center equipment.

For Anthropic, the continuously growing demand for AI model training and inference means its appetite for compute power will remain high for the long term. The interests of both parties are highly aligned in this record-breaking transaction.

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