Company Encyclopedia
View More

UNION SEMICONDUCTOR (HEFEI)
688403.SH
Union Semiconductor (Hefei) Co., Ltd. provides high-end advanced packaging and testing services for display driver chips in China. The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services. Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electronics, smart wearables, electronic tags, and other categories.
6.665 T
688403.SHMarket value -Rank by Market Cap -/-
Valuation analysis

P/E
1Y
3Y
5Y
10Y
P/E
-
Industry Ranking
-/-
- P/E
- Price
- High
- Median
- Low
P/B
1Y
3Y
5Y
10Y
P/B
-
Industry Ranking
-/-
- P/B
- Price
- High
- Median
- Low
P/S
1Y
3Y
5Y
10Y
P/S
-
Industry Ranking
-/-
- P/S
- Price
- High
- Median
- Low
Dividend Yield
1Y
3Y
5Y
10Y
Dividend Yield
-
Industry Ranking
-/-
- Dividend Yield
- Price
- High
- Median
- Low
Institutional View & Shareholder
Analyst Ratings
- Price--
- Highest--
- Lowest--
News
View More
