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UNION SEMICONDUCTOR (HEFEI)
688403.SH
Union Semiconductor (Hefei) Co., Ltd. provides high-end advanced packaging and testing services for display driver chips in China. The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services. Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electronics, smart wearables, electronic tags, and other categories.
6.665 T
688403.SHMarket value -Rank by Market Cap -/-

Financial Score

26/12/2025 Update
B
SemiconductorsIndustry
Industry Ranking41/164
Industry medianC
Industry averageC
Score Analysis
Peer Comparison
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    Rating
  • Profit ScoreC
    • ROE5.54%C
    • Profit Margin10.61%B
    • Gross Margin22.92%D
  • Growth ScoreB
    • Revenue YoY22.17%A
    • Net Profit YoY18.36%B
    • Total Assets YoY6.50%B
    • Net Assets YoY10.67%B
  • Cash ScoreB
    • Cash Flow Margin942.47%B
    • OCF YoY22.17%A
  • Operating ScoreC
    • Turnover0.37C
  • Debt ScoreB
    • Gearing Ratio28.25%B

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