Eagle Materials

TSMC will expand 3nm capacity over 60% this year to meet strong demand for AI and high-performance computing chips, media report, citing VP T.S. Chang speaking at the TSMC Technology Symposium (Taiwan). The report says Apple, Qualcomm, Nvidia and AMD are taking up most of the new capacity. $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) $AMD(AMD.US) $Apple(AAPL.US) $Qualcomm(QCOM.US) #semiconductor #semiconductors

Source: Dan Nystedt

Japan’s Ajinomoto, producer of ABF film for the substrates used in GPU and CPU packaging, will invest ¥25 billion (US$166 million) to boost capacity of the insulating material by 50% over 5-years, Nikkei reports, adding it has already spent ¥25 billion over the past 2-years expanding production. The food company used its amino acid expertise to create ABF (Ajinomoto Build-up Film). $NVIDIA(NVDA.US) $Intel(INTC.US) $AMD(AMD.US) #semiconductors #semiconductor https://t.co/Poec4zLq1L

Source: Dan Nystedt

$XTALPI(02228.HK) is experiencing severe fluctuations at a high level, shaking and shaking, are you leaving or not, if you don't leave, I'm going to drop. 😜 Since you’re not leaving, I’ll keep shaking.