$Kulicke and Soffa(KLIC.US) No position, but stupidity has no limits. What has changed on the bottle necks since Samsungs ER? Anyways, no need to stress I think this is a great R/R trade here. First 50ma test in a while.
Kulicke and Soffa
KLIC74.2106.86% ( -5.470 )
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Fantastic report and call from #ASMPT ($0522.HK) with numerous industry implications:
Here are some of the key points:· Booking and Q3 revenue guide above expectations· China demand strong; EV and consumer· ASMPT confident in TCB wins for HBM4 and CoW part of CoWoS· Seeing signs of mainstream demand recovery· Wire Bonder tool demand picking up; from AI and mainstream applications$BESI, $Kulicke and Soffa(KLIC.US), #Shibaura($6590.T), $KLA(KLAC.US), $Applied Materials(AMAT.US), $TE Connectivity(TEL.US), $LCRXSource: Chips & Wafers
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As #AdvancedPackaging become more important and enabling, we are likely to see in increase in the number of tool suppliers.
"Hanwha Semiconductor has established the 'Advanced Packaging Equipment Development Center' ... plans to focus on the development of new technologies such as hybrid bonding."$BESI #ASMPT $Kulicke and Soffa(KLIC.US) #Hanmi #ShibauraSource: Chips & Wafers
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Chinese company, Qinghe Wafer, recently announced a Hybrid Bonding tool with impressive specs:
▫️Bonding accuracy: 100nm▫️UPH: 1,000I'd assume those don't go together; meaning they are not hitting 100nm accuracy at 1,000 UPH.But still, it pays to keep a keen eye on Chinese Equipment Manufacturers for breakthroughs in advanced packaging machines.This article also talks about Chinese companies developing temporary bonding/debonding tools, which are key for applications like HBM stacks and CoWoS packages.$BESI $SMHN #ASMPT #EVG $Kulicke and Soffa(KLIC.US) $Camtek(CAMT.US)Source: Chips & Wafers
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Chips & Wafers was created to go deeper than this report from JP Morgan.
The reality is that WFE is far too broad a term to be a meaningful metric. WFE includes:· Bare Wafer Manufacturing tools like handlers, grinders and dicers· Chip Manufacturing tools like deposition, litho and etch equipment· Packaging equipment like wire bonders and flip chip tools· Photomask manufacturing equipment· ATE toolsThe point is if you are investing in $Applied Materials(AMAT.US) or $TE Connectivity(TEL.US) why would you model the business using a data set that includes wire bonders from $Kulicke and Soffa(KLIC.US) and grinders from #Disco?The key to good data is that it must be Timely and it must be Targeted."The only thing more dangerous than navigating with no map, is navigating with the wrong map" Get the most valuable data:Source: Chips & Wafers
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$Micron Tech(MU.US) to move towards Fluxless TCB for their next gen #HBM.
Once again, the HBM competition is heating up around the specific packaging technology being employed.$SEC #SKHynix #ASMPT $Kulicke and Soffa(KLIC.US) #HanmiSource: Chips & Wafers