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13 hours ago
Intel secures another major order for advanced packaging; SK Hynix's next-generation HBM will incorporate EMIB technology.
"South Korean memory giant SK Hynix announcing that it will incorporate Intel's EMIB advanced packaging technology into its next-generation high-bandwidth memory (HBM)." "Industry analysts believe that when Intel previously introduced its EMIB 2.5D solution, it mentioned that the EMIB-T version incorporates TSV technology to enhance vertical power supply and support design conversion from other packaging technologies. This aligns perfectly with SK Hynix's direction of releasing HBM4 towards doubling the number of I/Os and adding TSV technologies, which is likely one of the reasons why SK Hynix adopted Intel's advanced EMIB packaging."$Intel(INTC.US) $SK Hynix(SKHY.US)
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