GL TECH: The company's domestically produced semiconductor equipment has entered full production status

GL TECH released the investor relations activity record. Since entering July, the company's delivery speed of domestic semiconductor equipment has been accelerating, and it is currently in a state of full production, with new orders continuously increasing. In the short term, a good supply trend is expected to continue in the fourth quarter. The 8231, suitable for high-precision cutting in ultra-thin wafers, CPO co-packaged optics, and other computing center data internet scenarios, as well as the 7260 for efficient packaging body cutting and sorting, have both entered the verification stage. The 12-inch laser slotting machine is expected to enter client verification in the fourth quarter of 2025, while the 8-inch laser dicing machine is expected to enter client verification by the end of 2025. The grinding machine 3230 has also entered client verification