Shenzhen Gas completed the issuance of 1.5 billion yuan in technology innovation bonds

Shenzhen Gas announced that the company's fifth board of directors' 22nd meeting approved the application for the registration of no more than 15 billion yuan of ultra-short-term financing bonds within 24 months, with a validity period of 2 years. The company completed the registration of 15 billion yuan on February 25, 2025, and completed the issuance of the third phase of technology innovation bonds for 2025, referred to as "25 Shenzhen Gas SCP003," with a term of 269 days, and both the planned and actual issuance amount was 1.5 billion yuan, with a coupon rate of 1.64%. The lead underwriter is Bank of Beijing, and the co-lead underwriter is Bank of Hangzhou