<div id="readability-page-1">News: Suppliers Building on more than 30 years of collaboration, process equipment maker Applied Materials Inc of Santa Clara, CA, USA has announced a new innovation partnership with foundry Taiwan Semiconductor Manufacturing Company Ltd (TSMC) to accelerate the development and commercialization of semiconductor technologies required for the next era of AI. Working together at Applied’s EPIC Center in Silicon Valley, the companies will co-innovate to advance materials engineering, equipment innovation, and process integration technologies designed to deliver energy-efficient performance from the data center to the edge. Applied’s new $5bn EPIC (Equipment and Process Innovation and Commercialization) Center in Silicon Valley represents the largest-ever US investment in advanced semiconductor equipment R&amp;D. The center, which will be operationally ready this year, is designed to reduce the time it takes to commercialize breakthrough technologies from early-stage research to full-scale manufacturing. For chipmakers, the EPIC Center will provide earlier access to Applied’s R&amp;D portfolio, faster cycles of learning, and accelerated transfer of next-generation technologies into high-volume manufacturing, within a secure collaborative environment. In addition, the co-innovation programs at the EPIC Center will provide Applied with greater multi-node visibility to guide R&amp;D investments while increasing R&amp;D productivity and value sharing.“Applied and TSMC share a long history of deep collaboration built on trust and a shared commitment to advancing innovation at the leading edge of semiconductor technology,” says Applied Materials’ president &amp; CEO Gary Dickerson. “By bringing our teams together at the EPIC Center, we are strengthening that partnership and accelerating the development of technologies to address the unprecedented complexity driving the chipmaking roadmap,” he adds. “As semiconductor device architectures evolve with each new generation, the demands on materials engineering and process integration continue to increase,” comments TSMC executive VP &amp; co-chief operating officer Dr Y.J. Mii. “Meeting the challenges of AI at a global scale requires industry-wide collaboration. Applied Materials’ EPIC Center provides an ideal environment to accelerate equipment and process readiness for next-generation technologies.” Through the EPIC Center, Applied and TSMC will collaborate on materials engineering innovations targeting the most critical challenges facing advanced logic scaling. Areas of focus include:<ul> <li>process technologies that enable continuous power, performance and area improvements across leading-edge logic nodes, addressing the growing demands of AI and high-performance computing; </li> <li>new materials and next-generation manufacturing equipment enabling precise formation of increasingly complex 3D transistor and interconnect structures; </li> <li>advanced process integration approaches that improve yield, variability control and reliability as devices move toward vertically stacked and highly scaled architectures. </li></ul>“Advancing leading foundry technologies calls for a new model for collaboration and innovation,” says Dr Prabu Raja, president of the Semiconductor Products Group at Applied Materials. “As a founding partner of the EPIC Center, TSMC gains earlier access to Applied’s innovation teams and next-generation equipment, helping accelerate the path from technology development to high-volume manufacturing.”Applied MaterialsTSMCwww.tsmc.comwww.appliedmaterials.com </div>

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Applied Materials and TSMC have announced a new partnership at Applied's EPIC Center in Silicon Valley to accelerate semiconductor technology development for AI. This collaboration builds on over 30 years of partnership and aims to enhance materials engineering and process integration. The $5 billion EPIC Center will facilitate faster commercialization of technologies and provide chipmakers with earlier access to R&D. Both companies emphasize the need for industry-wide collaboration to meet the challenges of evolving semiconductor architectures and AI demands.

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Applied Materials and TSMC partner at EPIC Center in Silicon Vallley to accelerate AI scaling