<div id="readability-page-1"><figure></figure> <p>The semiconductor race in advanced process technology is accelerating. As the first batch of 2nm chips is expected to enter production later this year, TSMC is already looking further ahead and has reportedly begun planning for 1nm process development. To prepare for future demand and long-term technology upgrades, the company is also building up to 12 new wafer fabs, which will serve as key production bases for nodes ranging from 2nm to 1.4nm. However, full commercialization of 1nm technology still faces significant time and infrastructure constraints. Due to delays in land acquisition for the Longtan Phase III expansion project, mass production of 1nm chips is unlikely to begin before 2030 or 2031. [TechWeb, in Chinese]</p></div>

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<p>TSMC is advancing its semiconductor technology roadmap by planning for 1nm chip development while preparing to build up to 12 new wafer fabs. The first batch of 2nm chips is set to enter production this year, but full commercialization of 1nm technology may not occur until 2030 or 2031 due to infrastructure challenges.</p>

- The semiconductor industry is advancing rapidly, with TSMC preparing to produce 2nm chips and planning for 1nm process development.  
- The company is constructing up to 12 new wafer fabs to support production across nodes from 2nm to 1.4nm.  
- However, mass production of 1nm chips may be delayed until 2030 or 2031 due to infrastructure and land acquisition issues.

TSMC plans 1nm chip roadmap and up to 12 new fabs