CPO Optical Interconnect Market Projected to Surge by 2026
The AI computing power bottleneck is shifting towards optical interconnects, with the Co-Packaged Optics (CPO) market expected to experience significant growth by 2026. According to PANews, the market size is projected to increase from $160 million to $91 billion. NVIDIA has made a $4 billion investment, and silicon photonics foundry leader Tower Semiconductor (TSEM) has secured its production capacity until 2028, indicating the start of a supercycle in optical interconnects.
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