Onto Innovation

Semiconductor test and metrology have become the key factor in AI chip yield, cost, performance and mass production speed, moving this formerly behind-the-scenes work to the fore, media report, citing SEMI Taiwan President Terry Tsao. Instead of just catching defects, modern test and metrology equipment now feeds real-time insights back to the design, fabrication and packaging stages for faster troubleshooting. System-Level Testing (SLT), burn-in testing, and reliability verification have all moved up in importance. #Advantest $Teradyne(TER.US) $Applied Materials(AMAT.US) $KLA(KLAC.US) $Onto Innovation(ONTO.US) $Nova(NVMI.US)

Source: Dan Nystedt

Testing: The critical bottleneck in CPO mass production (TrendForce)

$Onto Innovation(ONTO.US) is a semi-conductor testing company. This is an interesting look on the weekly.

$Semiconductor(CP00062.US). Jack

$Onto Innovation(ONTO.US) for those who like IHS patterns on the daily look at this one. None here, scrolling charts.

Source: Sunrise Trader

Advanced Packaging is running on all cylinders. Don't forget that beyond assembly, you need to test those packages too!

Source: Chips & Wafers

Taiwan’s big memory chip packaging OSAT firms have hiked prices 30% amid strong demand, media report, adding Powertech, Walton and ChipMOS may have to hike prices again amid “overwhelming orders” and nearly full capacity. The 3 companies declined to comment. $BESI $Onto Innovation(ONTO.US) $KLA(KLAC.US) #semiconductors #semiconductor

Source: Dan Nystedt

Laura Peters from @SemiEngineering talks about the latest trends discussed at #ECTC. A few things stood out:

Source: Chips & Wafers

Onto runs into 2.5D tool capability gap at a customer. Share loss. Hoping to regain next year. Meaningful pause in memory in QJun. Expectation changes to market perform from WFE outperform.

Source: Sravan Kundojjala

Great news.

Source: Chips & Wafers