Avnet’s Hackster partners with Autodesk, Arduino, Qualcomm, PCBWay on AU 2027 product design challenge
PUBT·
- Avnet’s Hackster.io has partnered with Autodesk, Arduino, Qualcomm, and PCBWay to launch a product design competition for Autodesk University 2027.
- The contest focuses on connected-device concepts built using Autodesk Fusion, Arduino UNO Q, and prototyping support backed by PCBWay.
- The winning device will be manufactured and distributed to approximately 750 attendees at Autodesk University 2027.
