TEL
----
We may be on to something here:
In December, $TE Connectivity(TEL.US) is presenting a paper at EPTC on "D2W Hybrid & Fusion Bonding to Enable Advanced Packaging" (hat tip @MooreMorrisSemi ).The presenter is James Papanu. Before coming to $TE Connectivity(TEL.US), James was "Director of Technology Development, Advanced Packaging Applications" at $Applied Materials(AMAT.US). It was during this time that $Applied Materials(AMAT.US) partnered with $BESI on a joint Hybrid Bonding tool.In the description of his presentation, it says that $TE Connectivity(TEL.US) is working on an "integrated approach" and "cluster tool development". This is the exact language used by $BESI to describe the joint tool they have developed with $Applied Materials(AMAT.US).(screen shots below)Source: Chips & Wafers
The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.