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TOKYO ELECTRON UNSPON ADR EACH REPR 1 SHS

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  • A
    AI GossipAug 14 at 04:56 AM

    Taiwan DRAM maker Nanya Tech plans to build new 12-inch wafer fabs in Yunlin and Pingtung, Taiwan for DRAM and customized DRAM, media report.

    -The Yunlin fab will focus on sub-10nm process node products for AI.

    -Nanya’s latest project, the NT$300 billion Linkou 5A DRAM fab, due for mass production in 2028

    -Media quote a Nanya executive confirming plans for additional new fabs, but declining to comment where. $Applied Materials(AMAT.US) $ASML(ASML.US) $Lam Research(LRCX.US) $KLA(KLAC.US) $Tokyo Electron(TOELY.US) #semiconductors

    Source: Dan Nystedt

  • A
    AI GossipJul 30 at 12:47 AM

    TSMC’s operation in Kumamoto, Japan is recovering and will need some time to recalibrate equipment after the 7.1-magnitude earthquake, tripping safety systems and halting production, media report. TSMC said the fab structure, water supply, power and safety systems are all normal, and detailed inspections continue. Construction of the 2nd fab has resumed.

    Japan’s Sony Semiconductor, Renesas and Tokyo Electron also halted production and are undertaking safety inspections.

    (Note: TSMC is no stranger to earthquakes. The Kumamoto fab could be back in full production in a week. The amount of time it takes will tell us a lot about the damage.) $Taiwan Semiconductor(TSM.US) $Sony(SONY.US) $RNECY $Tokyo Electron(TOELY.US) #Japan #Kumamoto #semiconductors

    Source: Dan Nystedt

  • E
    Equity researchJul 24 at 01:34 PM

    Morgan Stanley: Intel CapEx Spend

    Core Forecasts and Capex Revisions

    > WFE and Capex Projections: The 2027 WFE forecast is set at $202 billion (a 31% year-over-year increase), which incorporates a $25 billion capex assumption specifically for Intel, though analysts see potential for further upside.

    > Upward Revisions: Intel previously revised its 2026 capex outlook to over $20 billion and signaled that 2027 capex will be "significantly above 2026 levels".

    > CPU Demand Drivers: Producing 5 million incremental Xeon 6 units requires an estimated $5.3 billion+ in WFE. Expanding logic wafer capacity to capture two-thirds of incremental CPU units (22.4 million units through 2030) demands a minimum of $23.8 billion for Xeon 6 and $27.9 billion for Xeon 7.

    Key Equipment Beneficiaries

    > Outside the US:

    Tokyo Electron (TEL): Historically counts Intel as a major customer (ranging from over 10% up to 20.4% in F3/20).

    Lasertec: Has seen Intel represent 10% or more of its customer base historically, peaking at 31.6% in F6/22.

    > Within the US:

    KLA Corp (KLAC): Highlighted as an outsized US beneficiary. Although Intel has not been a 10% customer since F6/15, Intel is heavily leaning on KLA to improve manufacturing yields and margins to succeed as a viable foundry, positioning KLA for potential massive revenue growth from Intel between 2025 and 2027.

    $KLA $Intel(INTC.US)

    图片 1,共 1 张
  • A
    AI GossipJun 18 at 06:15 AM

    Elon Musk’s TeraFab is a major project and new opportunity that will test ASML’s supply chain, said ASML CEO Christophe Fouquet, comparing the size to the millions-of-wafers DRAM fab projects going on in South Korea, in an interview with Bloomberg. 1/3 $SpaceX(SPCX.US) $ASML(ASML.US) $SSNLF $HXSCL $Applied Materials(AMAT.US) $Tokyo Electron(TOELY.US) $Lam Research(LRCX.US) #terafab #semiconductors

    Source: Dan Nystedt

  • A
    AI GossipJun 16 at 06:55 AM

    TSMC has built two CoPoS advanced packaging production test lines, one for foreign tools and the other for domestic, making them compete head on in process stability, lead time, cost, and service, media report, adding institutional investors are watching to see which Taiwan vendors can win a place in the new production lines. Some domestic firms are optimistic that their ability to respond rapidly to TSMC’s needs, cost competitiveness, more, will help them win. The paper names some of Taiwan’s best: Scientech, All Ring Tech, Grand Process Technology, more. $Taiwan Semiconductor(TSM.US) $Tokyo Electron(TOELY.US) $KLA(KLAC.US) $Applied Materials(AMAT.US) $ASML(ASML.US) $CSJ #Screen #Disco #semiconductors

    Source: Dan Nystedt

  • A
    AI GossipMay 6 at 12:17 AM

    TSMC is spending over NT$100 billion (US$3.1 billion) to upgrade Fab 15A to 4nm from 28/22nm, and the older equipment will be shipped to its Dresden, Germany fab, media report, adding construction of TSMC’s 1.4nm fab project is in full swing and progressing better than expected. $Taiwan Semiconductor(TSM.US) $ASML(ASML.US) $Applied Materials(AMAT.US) $Lam Research(LRCX.US) $KLCA $Tokyo Electron(TOELY.US) #semiconductors #semiconductor #Germany

    Source: Dan Nystedt

  • A
    AI GossipApr 27 at 05:07 AM

    Chip toolmaker Tokyo Electron cuts ties with executive who helped build its China business, then left after links to start-ups surfaced. $Tokyo Electron(TOELY.US) $8035 #semiconductors

    Source: Dan Nystedt

  • A
    AI GossipMar 30 at 01:27 AM

    TSMC 2nm tech leak case: Taiwan’s IP/Commercial court finished oral arguments and a verdict is expected April 27, media report, adding 2 of the accused will be detained another 2-months so they cannot destroy evidence. Prosecutors say they collected 2nm data to boost the performance of Tokyo Electron’s etching equipment so it could supply TSMC’s 2nm fabs. $Taiwan Semiconductor(TSM.US) $Tokyo Electron(TOELY.US) #semiconductors

    Source: Dan Nystedt

  • A
    AI GossipMar 15 at 12:27 PM

    The rumored site for TSMC’s first 1.2nm process fabs, the Shalun science park, will undergo an environmental assessment in April this year, a delay from the original end-2025 timeframe because the land overlaps with the habitat of a protected bird of prey (owl), media report. The Shalun science park, with 531-hectares of land, is expected to eventually generate annual output of NT$2.25 trillion (US$70B) worth of goods and employ 35,000 people. $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) $Apple(AAPL.US) $Applied Materials(AMAT.US) $ASML(ASML.US) $Tokyo Electron(TOELY.US) $KLA(KLAC.US)

    Source: Dan Nystedt

  • A
    AI GossipMar 9 at 03:17 AM

    Memory chip maker Winbond Electronics’ capacity is booked into 2027 and it will be cautious taking any orders that run over 3-months amid continued strong demand, media report, noting its February sales hit a record high for the 3rd straight month, up 91.2% year-on-year to NT$23.8 billion, despite fewer working days. Winbond plans to spend NT$42.1 billion (US$1.3 billion) on capex this year, up from NT$5.5 billion last year, to boost capacity. $Lam Research(LRCX.US) $KLA(KLAC.US) $Applied Materials(AMAT.US) $ASML(ASML.US) $Tokyo Electron(TOELY.US) #Winbond #Semiconductors

    Source: Dan Nystedt