Rumor: Intel Malaysia took over some advanced packaging for TSMC due to a surge in orders for CoWoS packaging by a major mutual client, media report, adding ASE, Unimicron, Gudeng Precision and others are also expected to benefit from the move. TSMC is expected to ship more advanced chips as the packaging bottleneck eases. $Intel(INTC.US) $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) $Alphabet(GOOGL.US) $NVIDIA(NVDA.US) #semiconductors
Source: Dan Nystedt
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