<p>/PRNewswire/ -- NewPhotonics Ltd 今日推出了业界首款 NPG10240 3.2Tbps PIC，配备 448Gbps 调制解调器、集成激光器和 OSPic™ 光信号处理器。该产品旨在为下一代 AI 基础设施提供服务，激光集成信号均衡引擎提供高密度 400G/通道连接，具有更高的能效和简化的设计，适用于可插拔和高密度近封装光学（NPO）架构。</p>
<p><img src="https://imageproxy.pbkrs.com/https://mma.prnewswire.com/media/2859143/NewPhotonics_New_Logo.jpg?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" width="400" height="89" original-src="https://imageproxy.pbkrs.com/https://mma.prnewswire.com/media/2859143/NewPhotonics_New_Logo.jpg"/></p>
<p>翻转芯片八通道发射器将激光源、高速调制解调器和可编程光均衡集成在一个紧凑的引擎中，支持 3.2Tbps DR8 连接的超大规模部署。通过在光学领域处理电气损伤，专有的 OSPic 引擎减少了射频设计限制，增强了信号完整性，并在每个通道 448Gbps 的情况下实现了更一致的链路性能。</p>
<p>“AI 集群正在迅速推动向更高速光互连的过渡，行业正在从 800G 和 1.6T 迈向下一个扩展阶段的 3.2T，” LightCounting 创始人 Vlad Kozlov 说。“高度集成的光子引擎结合了激光器、调制解调器和先进的信号调理，将在实现更高数据速率的同时保持能效和制造可扩展性方面发挥重要作用。”</p>
<p>NPG10240 的主要特点和优势包括：</p>
<ul>
<li>紧凑、高度集成的 3.2T 引擎，针对可插拔和高密度 NPO 架构进行了优化。</li>
<li>OSPic 光学域均衡，缓解电气射频损伤，放宽射频设计限制，同时改善信号完整性和整体链路性能。</li>
<li>异构激光集成，减少光耦合损失，最小化外部组件需求，提高整体系统能效。</li>
<li>翻转芯片封装，简化系统组装，提高 OEM 制造良率，改善长期收发器可靠性。</li>
</ul>
<p>“比带宽扩展更重要的是 AI 工厂对可扩展光集成的需求，以在更高的制造效率下提供更低的功耗，” NewPhotonics 光连接高级副总裁兼总经理 Doron Tal 说。“我们的 3.2Tbps 级光学解决方案消除了在最苛刻架构中部署 448G/通道光学的关键障碍。”</p>
<p>NewPhotonics 的芯片上发射器采样计划，提供 3.2T 解决方案，将于 2026 年第四季度推出。</p>
<p><strong>关于 NewPhotonics</strong></p>
<p>NewPhotonics® 是一家无晶圆半导体公司，提供创新的光子集成电路解决方案，以扩展超大规模和数据中心互连，提升 AI 集群性能。该公司的激光集成 PIC 和 OSPic™ 全光信号处理实现了市场颠覆性的能效和生产简便性，适用于 DSP 和 LPO+ 可插拔、NPO 和 CPO 芯片解决方案。NewPhotonics 成立于 2020 年，属于私人持有并获得资金支持。有关更多信息，请访问 www.newphotonics.com。</p>
<p>媒体联系：</p>
<p>企业传播</p>
<p>press.relations@newphotonics.com</p>
<p>+972 3 614-3147</p>
<p>Logo - https://mma.prnewswire.com/media/2859143/5856414/NewPhotonics_New_Logo.jpg</p>
<p><img src="https://imageproxy.pbkrs.com/https://edge.prnewswire.com/c/img/favicon.png/query-c2Q9MjAyNi0wMy0xMiZzbj1MTjA2ODMx?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" width="16" height="16" original-src="https://imageproxy.pbkrs.com/https://edge.prnewswire.com/c/img/favicon.png/query-c2Q9MjAyNi0wMy0xMiZzbj1MTjA2ODMx"/></p>
<p>查看原始内容以下载多媒体：https://www.prnewswire.com/news-releases/newphotonics-introduces-industry-first-3-2tbps-dr8-transmitter-on-chip-pic-with-integrated-ospic-optical-signal-processor-for-ai-data-center-connectivity-302711543.html</p>
<p>来源：NewPhotonics Ltd</p>

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<p>NewPhotonics 有限公司推出了 NPG10240，这是首款集成 OSPIC™光信号处理器的 3.2Tbps 芯片级发射器，旨在增强人工智能数据中心的连接性。该紧凑型引擎配备 448Gbps 调制解调器和激光集成，提高了能效并简化了高密度架构的设计。OSPIC 引擎增强了信号完整性和性能，响应了行业向更高速光互连的转变。该创新解决方案的采样计划将在 2026 年第四季度推出，标志着光集成在人工智能基础设施中的重要进展</p>

<p>, /PRNewswire/ -- NewPhotonics Ltd, today unveiled the industry first NPG10240 3.2Tbps PIC with 448Gbps modulators, integrated lasers and OSPic™ optical signal processor. Designed for next-generation AI infrastructure, the laser-integrated signal equalization engine delivers high-density 400G/lane connectivity with improved power efficiency and simplified design for pluggable and high density near-package optics (NPO) architectures.</p>
<div class="lb-trans"><p>/PRNewswire/ -- NewPhotonics Ltd 今日推出了业界首款 NPG10240 3.2Tbps PIC，配备 448Gbps 调制解调器、集成激光器和 OSPic™ 光信号处理器。该产品旨在为下一代 AI 基础设施提供服务，激光集成信号均衡引擎提供高密度 400G/通道连接，具有更高的能效和简化的设计，适用于可插拔和高密度近封装光学（NPO）架构。</p>
</div><p><img src="https://imageproxy.pbkrs.com/https://mma.prnewswire.com/media/2859143/NewPhotonics_New_Logo.jpg" alt="" original-src="https://mma.prnewswire.com/media/2859143/NewPhotonics_New_Logo.jpg"/></p>
<p>The flip-chip octal-channel transmitter integrates laser sources, high-speed modulators, and programmable optical equalization in a compact engine for hyperscale deployment at 3.2Tbps DR8 connectivity. By processing electrical impairments in the optical domain, the proprietary OSPic engine reduces RF design constraints, enhances signal integrity, and enables more consistent link performance at 448Gbps per lane.</p>
<div class="lb-trans"><p>翻转芯片八通道发射器将激光源、高速调制解调器和可编程光均衡集成在一个紧凑的引擎中，支持 3.2Tbps DR8 连接的超大规模部署。通过在光学领域处理电气损伤，专有的 OSPic 引擎减少了射频设计限制，增强了信号完整性，并在每个通道 448Gbps 的情况下实现了更一致的链路性能。</p>
</div><p>&#34;AI clusters are rapidly driving the transition to higher-speed optical interconnects, with the industry moving from 800G and 1.6T to 3.2T in the next phase of scaling,&#34; said Vlad Kozlov, Founder, LightCounting. &#34;Highly integrated photonic engines that combine lasers, modulators and advanced signal conditioning will play an important role in enabling these higher data rates while maintaining power efficiency and manufacturing scalability.&#34;</p>
<div class="lb-trans"><p>“AI 集群正在迅速推动向更高速光互连的过渡，行业正在从 800G 和 1.6T 迈向下一个扩展阶段的 3.2T，” LightCounting 创始人 Vlad Kozlov 说。“高度集成的光子引擎结合了激光器、调制解调器和先进的信号调理，将在实现更高数据速率的同时保持能效和制造可扩展性方面发挥重要作用。”</p>
</div><p>Key features and benefits of the NPG10240 include:</p>
<div class="lb-trans"><p>NPG10240 的主要特点和优势包括：</p>
</div><ul>
<li>Compact, highly integrated 3.2T engine optimized for pluggable and high-density NPO architectures.</li>
<li>OSPic optical domain equalization mitigating electrical RF impairments to relax RF design constraints while improving signal integrity and overall link performance.</li>
<li>Heterogeneously laser integration that reduces optical coupling losses, minimizes external component requirements and improves overall system power efficiency.</li>
<li>Flip-chip packaging for simplified system assembly that enhances OEM manufacturing yield and improves long-term transceiver reliability.</li>
</ul>
<div class="lb-trans"><ul>
<li>紧凑、高度集成的 3.2T 引擎，针对可插拔和高密度 NPO 架构进行了优化。</li>
<li>OSPic 光学域均衡，缓解电气射频损伤，放宽射频设计限制，同时改善信号完整性和整体链路性能。</li>
<li>异构激光集成，减少光耦合损失，最小化外部组件需求，提高整体系统能效。</li>
<li>翻转芯片封装，简化系统组装，提高 OEM 制造良率，改善长期收发器可靠性。</li>
</ul>
</div><p>&#34;More important than bandwidth expansion is the AI factory requirement for scalable optical integration delivering lower power at higher manufacturing efficiency,&#34; said Doron Tal, SVP and GM of Optical Connectivity at NewPhotonics. &#34;Our 3.2Tbps class optical solution removes key barriers to deploying 448G/lane optics across the most demanding architectures.&#34;</p>
<div class="lb-trans"><p>“比带宽扩展更重要的是 AI 工厂对可扩展光集成的需求，以在更高的制造效率下提供更低的功耗，” NewPhotonics 光连接高级副总裁兼总经理 Doron Tal 说。“我们的 3.2Tbps 级光学解决方案消除了在最苛刻架构中部署 448G/通道光学的关键障碍。”</p>
</div><p>The NewPhotonics transmitter-on-chip sampling program featuring 3.2T solutions will be available in Q4 2026.</p>
<div class="lb-trans"><p>NewPhotonics 的芯片上发射器采样计划，提供 3.2T 解决方案，将于 2026 年第四季度推出。</p>
</div><p><strong>About NewPhotonics</strong></p>
<div class="lb-trans"><p><strong>关于 NewPhotonics</strong></p>
</div><p>NewPhotonics® is a fabless semiconductor company delivering innovative photonic IC solutions that scale hyperscaler and data center interconnect for AI cluster performance. The company's laser-integrated PICs and OSPic™ all-optical signal processing enable market-disrupting energy efficiency and production simplicity for DSP and LPO+ pluggable, NPO, and CPO chip solutions. Founded in 2020, NewPhotonics is privately held and funded. For more information, visit www.newphotonics.com.</p>
<div class="lb-trans"><p>NewPhotonics® 是一家无晶圆半导体公司，提供创新的光子集成电路解决方案，以扩展超大规模和数据中心互连，提升 AI 集群性能。该公司的激光集成 PIC 和 OSPic™ 全光信号处理实现了市场颠覆性的能效和生产简便性，适用于 DSP 和 LPO+ 可插拔、NPO 和 CPO 芯片解决方案。NewPhotonics 成立于 2020 年，属于私人持有并获得资金支持。有关更多信息，请访问 www.newphotonics.com。</p>
</div><p>Press Contact:</p>
<div class="lb-trans"><p>媒体联系：</p>
</div><p>Corporate Communications</p>
<div class="lb-trans"><p>企业传播</p>
</div><p>press.relations@newphotonics.com</p>
<div class="lb-trans"><p>press.relations@newphotonics.com</p>
</div><p>+972 3 614-3147</p>
<div class="lb-trans"><p>+972 3 614-3147</p>
</div><p>Logo - https://mma.prnewswire.com/media/2859143/5856414/NewPhotonics_New_Logo.jpg</p>
<div class="lb-trans"><p>Logo - https://mma.prnewswire.com/media/2859143/5856414/NewPhotonics_New_Logo.jpg</p>
</div><p><img src="https://imageproxy.pbkrs.com/https://edge.prnewswire.com/c/img/favicon.png/query-c2Q9MjAyNi0wMy0xMiZzbj1MTjA2ODMx" alt="" original-src="https://edge.prnewswire.com/c/img/favicon.png?sn=LN06831&amp;sd=2026-03-12"/></p>
<p>View original content to download multimedia:https://www.prnewswire.com/news-releases/newphotonics-introduces-industry-first-3-2tbps-dr8-transmitter-on-chip-pic-with-integrated-ospic-optical-signal-processor-for-ai-data-center-connectivity-302711543.html</p>
<div class="lb-trans"><p>查看原始内容以下载多媒体：https://www.prnewswire.com/news-releases/newphotonics-introduces-industry-first-3-2tbps-dr8-transmitter-on-chip-pic-with-integrated-ospic-optical-signal-processor-for-ai-data-center-connectivity-302711543.html</p>
</div><p>SOURCE NewPhotonics Ltd</p>
<div class="lb-trans"><p>来源：NewPhotonics Ltd</p>
</div>

NewPhotonicsÂ® Introduces Industry First 3.2Tbps DR8 Transmitter-on-Chip PIC with Integrated OSPicâ¢ Optical Signal Processor for AI Data Center Connectivity

NewPhotonics® 推出业界首款 3.2Tbps DR8 芯片级发射器 PIC，集成了 OSPic™光信号处理器，专为 AI 数据中心连接而设计