<p>作者：William Gavin</p>
<p>据报道，该公司正在与韩国的 SK 海力士合作开发新的芯片封装技术。</p>
<p>一位高管表示，英特尔的代工业务即将达成一些每年价值数十亿美元的封装收入交易。</p>
<p>投资者越来越多地看到英特尔的制造业务正在获得动力，而最新的乐观来源是有报告表明韩国半导体公司 SK 海力士可能很快成为合作伙伴。</p>
<p>据 ZDNet Korea 报道，SK 海力士（KR:000660）已开始与英特尔（INTC）合作进行 2.5D 封装技术的研发。报告称，SK 海力士还在考虑采用英特尔的 2.5D 封装技术，称为嵌入式多芯片互连桥（EMIB）。</p>
<p>封装是一个过程，通过该过程，公司将半导体芯片封装到保护壳中，以确保其安全并使其更易于安装。英特尔表示，其 EMIB 工艺有助于提升半导体设计的性能和功能。</p>
<p>根据报告，SK 海力士正在测试通过使用英特尔的 EMIB 集成高带宽内存，这是一种可以帮助降低功耗并提升带宽的内存芯片架构。</p>
<p>周一早盘，英特尔股价上涨近 4%，但随后涨幅有所回落。过去一个月，该股上涨超过 90%，投资者对公司转型为人工智能建设基石表示欢呼。</p>
<p>阅读更多：英特尔的股票刚刚经历了有史以来最爆炸性的增长。为什么怀疑者纷纷加入。</p>
<p>周一，SK 海力士在韩国的股价上涨超过 11%，达到 1,880,000 韩元（约合 1,279.15 美元）。该股在报告发布后曾达到 1,949,000 韩元的盘中高点。</p>
<p>这些公司没有立即回应置评请求。</p>
<p>据研究公司 TrendForce 报道，报告中的合作是在全球封装能力 “严重短缺” 的背景下进行的。部分原因是行业领导者台积电（TW:2330）的硅基芯片封装技术近年来出现了极端的供需失衡。</p>
<p>这使得客户寻求替代方案，这使得像安靠科技（AMKR）这样的公司受益，TrendForce 表示。英特尔的 EMIB 技术也获得了一些关注。</p>
<p>预计这种瓶颈将在明年开始略微缓解，因为台积电计划到 2027 年将其产能扩大超过 60%，TrendForce 表示。</p>
<p>尽管英特尔在 2.5D 封装能力方面排名第二，但台积电在美国芯片制造商中明显领先。根据 TrendForce 的预测，英特尔目前在全球产能中的份额约为 13.7%，而台积电为 69.8%，预计到 2027 年将降至 11.8%。</p>
<p>尽管有这样的预测，英特尔仍然预计封装将成为一项大业务。在 3 月份的摩根士丹利会议上，英特尔首席财务官 David Zinsner 表示，EMIB 及其更先进的 EMIB-T 工艺正在获得客户的 “非常好的反馈”。</p>
<p>上个月，亚马逊（AMZN）和谷歌母公司 Alphabet（GOOG）（GOOGL）被报道正在洽谈使用英特尔的封装服务。英特尔此前告诉 MarketWatch，它无法对传闻发表评论。</p>
<p>Zinsner 在 3 月份表示，英特尔的代工业务即将达成一些每年价值数十亿美元的封装收入交易。“所以，低调地说，这将成为我们非常好的业务，” Zinsner 在一份记录中补充道。</p>
<p>-William Gavin</p>
<p>此内容由 MarketWatch 创建，MarketWatch 由道琼斯公司运营。MarketWatch 与道琼斯新闻通讯和华尔街日报独立出版。</p>
<p>（完）道琼斯新闻通讯</p>
<p>05-11-26 1128ET</p>

台积电

04335

半导体 3 倍做多 - Direxion

<p>英特尔的股票在过去一个月中上涨了超过 90%，这主要受到对其代工业务的乐观情绪以及与 SK 海力士在新芯片封装技术方面潜在合作的推动。此次合作旨在增强 2.5D 封装能力，这可能显著提升英特尔的收入。尽管面临来自台积电的竞争，英特尔的 EMIB 技术正在获得关注，公司预计其封装业务将实现显著增长。投资者对英特尔制造部门的势头表示鼓舞，早盘股价上涨近 4%</p>

<p>By William Gavin</p>
<div class="lb-trans"><p>作者：William Gavin</p>
</div><p>The company is reportedly working with South Korea's SK Hynix on new chip-packaging technology</p>
<div class="lb-trans"><p>据报道，该公司正在与韩国的 SK 海力士合作开发新的芯片封装技术。</p>
</div><p>Intel's foundry business is close to closing &#34;some deals&#34; that are worth billions of dollars per year in terms of packaging revenue, according to an executive.</p>
<div class="lb-trans"><p>一位高管表示，英特尔的代工业务即将达成一些每年价值数十亿美元的封装收入交易。</p>
</div><p>Investors increasingly see signs that Intel's manufacturing business is gaining momentum - and the latest source of optimism is a new report suggesting that Korean semiconductor firm SK Hynix might soon become a partner.</p>
<div class="lb-trans"><p>投资者越来越多地看到英特尔的制造业务正在获得动力，而最新的乐观来源是有报告表明韩国半导体公司 SK 海力士可能很快成为合作伙伴。</p>
</div><p>SK Hynix (KR:000660) has reportedly started working with Intel (INTC) on research and development for 2.5D packing technology, according to ZDNet Korea. SK Hynix is also considering adopting Intel's 2.5D packaging technology called Embedded Multi-Die Interconnect Bridge, or EMIB, the report said.</p>
<div class="lb-trans"><p>据 ZDNet Korea 报道，SK 海力士（KR:000660）已开始与英特尔（INTC）合作进行 2.5D 封装技术的研发。报告称，SK 海力士还在考虑采用英特尔的 2.5D 封装技术，称为嵌入式多芯片互连桥（EMIB）。</p>
</div><p>Packaging is a process through which a company packs semiconductor chips into a protective shell that keeps them safe and makes them easier to install. Intel says its EMIB process helps scale performance and functionality of semiconductor designs.</p>
<div class="lb-trans"><p>封装是一个过程，通过该过程，公司将半导体芯片封装到保护壳中，以确保其安全并使其更易于安装。英特尔表示，其 EMIB 工艺有助于提升半导体设计的性能和功能。</p>
</div><p>SK Hynix is testing out integrating high-bandwidth memory, a memory-chip architecture that can help reduce power consumption and boost bandwidth, by using Intel's EMIB, according to the report.</p>
<div class="lb-trans"><p>根据报告，SK 海力士正在测试通过使用英特尔的 EMIB 集成高带宽内存，这是一种可以帮助降低功耗并提升带宽的内存芯片架构。</p>
</div><p>Intel shares rose almost 4% in early trading on Monday before gains were pared back. The stock has surged more than 90% over the last month as investors cheer the company's transformation into a cornerstone of the artificial-intelligence buildout.</p>
<div class="lb-trans"><p>周一早盘，英特尔股价上涨近 4%，但随后涨幅有所回落。过去一个月，该股上涨超过 90%，投资者对公司转型为人工智能建设基石表示欢呼。</p>
</div><p>Read more: Intel's stock just had its most explosive growth ever. Why skeptics are piling on.</p>
<div class="lb-trans"><p>阅读更多：英特尔的股票刚刚经历了有史以来最爆炸性的增长。为什么怀疑者纷纷加入。</p>
</div><p>SK Hynix shares in South Korea closed up more than 11%, reaching 1,880,000 won (equivalent to $1,279.15) in Monday trading. The stock had reached an intraday high of 1,949,000 won following the report.</p>
<div class="lb-trans"><p>周一，SK 海力士在韩国的股价上涨超过 11%，达到 1,880,000 韩元（约合 1,279.15 美元）。该股在报告发布后曾达到 1,949,000 韩元的盘中高点。</p>
</div><p>The companies did not immediately return a request for comment.</p>
<div class="lb-trans"><p>这些公司没有立即回应置评请求。</p>
</div><p>The reported collaboration comes amid a &#34;severe shortage&#34; in global packaging capacity, according to the research firm TrendForce. Part of that is because industry leader Taiwan Semiconductor Manufacturing's (TW:2330) Chip-on-Wafer-on-Substrate-with-Silicon packaging technology has seen an extreme supply-demand mismatch in recent years, according to the company.</p>
<div class="lb-trans"><p>据研究公司 TrendForce 报道，报告中的合作是在全球封装能力 “严重短缺” 的背景下进行的。部分原因是行业领导者台积电（TW:2330）的硅基芯片封装技术近年来出现了极端的供需失衡。</p>
</div><p>That has left customers seeking alternatives, which has benefited firms like Amkor Technology (AMKR), according to TrendForce. Intel's EMIB technology has also gained some traction.</p>
<div class="lb-trans"><p>这使得客户寻求替代方案，这使得像安靠科技（AMKR）这样的公司受益，TrendForce 表示。英特尔的 EMIB 技术也获得了一些关注。</p>
</div><p>That bottleneck is expected to begin easing slightly by next year, as TSMC aims to expand its capacity by over 60% by 2027, according to TrendForce.</p>
<div class="lb-trans"><p>预计这种瓶颈将在明年开始略微缓解，因为台积电计划到 2027 年将其产能扩大超过 60%，TrendForce 表示。</p>
</div><p>While Intel commands the second-greatest 2.5D packaging capacity, TSMC has a clear lead on the U.S. chip maker. Intel's share of global capacity currently stands at about 13.7%, compared with TSMC's 69.8%, and is expected to fall to 11.8% in 2027, according to TrendForce's projections.</p>
<div class="lb-trans"><p>尽管英特尔在 2.5D 封装能力方面排名第二，但台积电在美国芯片制造商中明显领先。根据 TrendForce 的预测，英特尔目前在全球产能中的份额约为 13.7%，而台积电为 69.8%，预计到 2027 年将降至 11.8%。</p>
</div><p>Despite that forecast, Intel still expects packaging to become a big business. At a Morgan Stanley conference in March, Intel's chief financial officer, David Zinsner, said that EMIB and its more advanced EMIB-T process have been getting &#34;really good engagement&#34; from customers.</p>
<div class="lb-trans"><p>尽管有这样的预测，英特尔仍然预计封装将成为一项大业务。在 3 月份的摩根士丹利会议上，英特尔首席财务官 David Zinsner 表示，EMIB 及其更先进的 EMIB-T 工艺正在获得客户的 “非常好的反馈”。</p>
</div><p>Last month, Amazon (AMZN) and Google-parent Alphabet (GOOG) (GOOGL) were reported to be in talks to use Intel's packaging services. Intel previously told MarketWatch that it cannot comment on rumors.</p>
<div class="lb-trans"><p>上个月，亚马逊（AMZN）和谷歌母公司 Alphabet（GOOG）（GOOGL）被报道正在洽谈使用英特尔的封装服务。英特尔此前告诉 MarketWatch，它无法对传闻发表评论。</p>
</div><p>Zinsner in March said that Intel's foundry business is near to closing &#34;some deals&#34; that are worth billions of dollars per year in terms of packaging revenue. &#34;So low and behold, this is going to be a really good business for us,&#34; Zinsner added, according to a transcript.</p>
<div class="lb-trans"><p>Zinsner 在 3 月份表示，英特尔的代工业务即将达成一些每年价值数十亿美元的封装收入交易。“所以，低调地说，这将成为我们非常好的业务，” Zinsner 在一份记录中补充道。</p>
</div><p>-William Gavin</p>
<div class="lb-trans"><p>-William Gavin</p>
</div><p>This content was created by MarketWatch, which is operated by Dow Jones &amp; Co. MarketWatch is published independently from Dow Jones Newswires and The Wall Street Journal.</p>
<div class="lb-trans"><p>此内容由 MarketWatch 创建，MarketWatch 由道琼斯公司运营。MarketWatch 与道琼斯新闻通讯和华尔街日报独立出版。</p>
</div><p>(END) Dow Jones Newswires</p>
<div class="lb-trans"><p>（完）道琼斯新闻通讯</p>
</div><p>05-11-26 1128ET</p>
<div class="lb-trans"><p>05-11-26 1128ET</p>
</div>

Intel's stock extends its hot streak. This is the latest source of optimism.

- 英特尔与韩国 SK 海力士合作研发新芯片封装技术。  
- 据称英特尔已与 SK 海力士达成数十亿美元的封装业务交易。  
- 封装技术需求上升，预计将推动英特尔的包装业务增长。

英特尔的股票持续走强。这是最新的乐观因素