<p>, /PRNewswire/ -- T-Global Technology 今天宣布，其旗舰项目 <strong>&#34;高导热材料及 HPC 芯片双相液冷模块的开发&#34;</strong> 已获得台湾经济部 <strong>&#34;A+ 驱动工业创新与 AI&#34; 计划</strong> 的正式批准。</p>
<p>继续阅读</p>
<p><img src="https://imageproxy.pbkrs.com/https://www.prnewswire.com/news-releases/null?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" original-src="https://imageproxy.pbkrs.com/https://www.prnewswire.com/news-releases/null"/></p>
<p>台湾 - 法国项目的商业领袖和组织者合影。照片来源：中华民国经济部。</p>
<p>随着 AI、高性能计算 (HPC) 和数据中心基础设施需求的持续增长，热管理已成为实现更高计算性能、能源效率和系统可靠性的关键因素。在为期两年的联合研发计划中，T-Global 将与 <strong>SiPearl</strong> 合作，后者是欧洲无晶圆厂的高性能、节能 CPU 设计商，开发下一代计算平台的先进热管理解决方案。</p>
<p>此次合作标志着 T-Global 在全球先进研发生态系统中的战略扩展的重要里程碑。通过将其在高性能热材料、模块设计优化和系统级验证方面的专业知识与 SiPearl 的先进处理器开发能力相结合，T-Global 旨在提供创新的冷却技术，以支持更高的芯片性能，同时降低能耗。</p>
<p>随着 AI 应用从大规模云基础设施迅速扩展到边缘计算，芯片级热流量持续显著上升。传统的冷却方法正逐渐达到其物理极限，使得先进的热解决方案对于维持下一波计算创新至关重要。通过此次台湾 - 法国合作，T-Global 正在加强其作为全球 HPC 和 AI 平台可信技术合作伙伴的角色。</p>
<p>&#34;我们很高兴能与 T-Global 合作，T-Global 是热管理解决方案领域的公认专家，参与其旗舰项目 '高导热材料及 HPC 芯片双相液冷模块的开发'。这个绝佳的机会进一步加强了 SiPearl 与台湾半导体生态系统的长期联系，得到了台湾经济部的支持，&#34; <strong>SiPearl 的首席执行官兼创始人 Philippe Notton</strong> 说道。</p>
<p>T-Global 始终致力于推动热管理创新，提供结合性能、稳定性和可靠性的综合解决方案。展望未来，公司将继续与全球合作伙伴合作，开发更高效、节能的冷却技术，使下一代计算系统能够在峰值性能下可靠运行，同时展示台湾在先进材料和工程整合方面的实力。</p>
<p>照片 - https://mma.prnewswire.com/media/2977897/02_2.jpg</p>
<p><img src="https://imageproxy.pbkrs.com/https://rt.prnewswire.com/rt.gif/query-RGF0ZUlkPTIwMjYwNTEzJk5ld3NJdGVtSWQ9RU41NzI5MiZUcmFuc21pc3Npb25fSWQ9MjAyNjA1MTMwNjE4UFJfTkVXU19FVVJPX05EX19FTjU3Mjky?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" original-src="https://imageproxy.pbkrs.com/https://rt.prnewswire.com/rt.gif/query-RGF0ZUlkPTIwMjYwNTEzJk5ld3NJdGVtSWQ9RU41NzI5MiZUcmFuc21pc3Npb25fSWQ9MjAyNjA1MTMwNjE4UFJfTkVXU19FVVJPX05EX19FTjU3Mjky"/></p>

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<p>T-Global 科技与法国 SiPearl 合作，旨在根据台湾经济事务部的计划开发高性能计算（HPC）的先进热管理解决方案。该为期两年的研发计划旨在创造高热导材料和双相液体冷却模块，以提升芯片性能和能效。这一合作标志着 T-Global 全球扩展的重要一步，并应对人工智能和高性能计算应用中日益增加的热流，确保下一代计算系统的可靠运行</p>

<p>, /PRNewswire/ -- T-Global Technology today announced that its flagship project, <strong>&#34;Development of High Thermal Conductivity Materials and Two-Phase Liquid Cooling Modules for HPC Chips,&#34;</strong> has been officially approved under Taiwan's Ministry of Economic Affairs' <strong>&#34;A+ Driving Industrial Innovation with AI&#34; Program</strong>.</p>
<div class="lb-trans"><p>, /PRNewswire/ -- T-Global Technology 今天宣布，其旗舰项目 <strong>&#34;高导热材料及 HPC 芯片双相液冷模块的开发&#34;</strong> 已获得台湾经济部 <strong>&#34;A+ 驱动工业创新与 AI&#34; 计划</strong> 的正式批准。</p>
</div><p>Continue Reading</p>
<div class="lb-trans"><p>继续阅读</p>
</div><p><img src="https://imageproxy.pbkrs.com/https://www.prnewswire.com/news-releases/null" alt="" original-src="https://www.prnewswire.com/news-releases/null"/></p>
<p>Taiwan-France project business leaders and organizers pose for a group photo. Photo source: MOEA, R.O.C.</p>
<div class="lb-trans"><p>台湾 - 法国项目的商业领袖和组织者合影。照片来源：中华民国经济部。</p>
</div><p>As demand for AI, high-performance computing (HPC), and data center infrastructure continues to accelerate, thermal management has become a critical factor in enabling higher computing performance, energy efficiency, and system reliability. Under this two-year joint R&amp;D initiative, T-Global will collaborate with <strong>SiPearl</strong>, the European fabless designer of high-performance, energy-efficient CPUs for HPC, AI, and data centers, to develop advanced thermal management solutions for next-generation computing platforms.</p>
<div class="lb-trans"><p>随着 AI、高性能计算 (HPC) 和数据中心基础设施需求的持续增长，热管理已成为实现更高计算性能、能源效率和系统可靠性的关键因素。在为期两年的联合研发计划中，T-Global 将与 <strong>SiPearl</strong> 合作，后者是欧洲无晶圆厂的高性能、节能 CPU 设计商，开发下一代计算平台的先进热管理解决方案。</p>
</div><p>The collaboration represents a key milestone in T-Global's strategic expansion into the global advanced R&amp;D ecosystem. By combining its expertise in high-performance thermal materials, module design optimization, and system-level validation with SiPearl's advanced processor development capabilities, T-Global aims to deliver innovative cooling technologies that support higher chip performance while reducing energy consumption.</p>
<div class="lb-trans"><p>此次合作标志着 T-Global 在全球先进研发生态系统中的战略扩展的重要里程碑。通过将其在高性能热材料、模块设计优化和系统级验证方面的专业知识与 SiPearl 的先进处理器开发能力相结合，T-Global 旨在提供创新的冷却技术，以支持更高的芯片性能，同时降低能耗。</p>
</div><p>With AI applications rapidly expanding from large-scale cloud infrastructure to edge computing, chip-level heat flux continues to rise significantly. Conventional cooling approaches are increasingly reaching their physical limits, making advanced thermal solutions essential to sustaining the next wave of computing innovation. Through this Taiwan–France collaboration, T-Global is strengthening its role as a trusted technology partner for global HPC and AI platforms.</p>
<div class="lb-trans"><p>随着 AI 应用从大规模云基础设施迅速扩展到边缘计算，芯片级热流量持续显著上升。传统的冷却方法正逐渐达到其物理极限，使得先进的热解决方案对于维持下一波计算创新至关重要。通过此次台湾 - 法国合作，T-Global 正在加强其作为全球 HPC 和 AI 平台可信技术合作伙伴的角色。</p>
</div><p>&#34;We are glad to be collaborating with T-Global, a recognized expert in the field of thermal management solutions, on its flagship project, 'Development of High Thermal Conductivity Materials and Two-Phase Liquid Cooling Modules for HPC Chips.' This excellent opportunity further strengthens SiPearl's long-standing ties with Taiwan's semiconductor ecosystem, under the auspices of the Taiwanese Ministry of Economic Affairs,&#34; said <strong>Philippe Notton, CEO and founder of SiPearl</strong>.</p>
<div class="lb-trans"><p>&#34;我们很高兴能与 T-Global 合作，T-Global 是热管理解决方案领域的公认专家，参与其旗舰项目 '高导热材料及 HPC 芯片双相液冷模块的开发'。这个绝佳的机会进一步加强了 SiPearl 与台湾半导体生态系统的长期联系，得到了台湾经济部的支持，&#34; <strong>SiPearl 的首席执行官兼创始人 Philippe Notton</strong> 说道。</p>
</div><p>T-Global remains committed to advancing innovation in thermal management and delivering comprehensive solutions that combine performance, stability, and reliability. Moving forward, the company will continue to work with global partners to develop more efficient, energy-saving cooling technologies that enable next-generation computing systems to operate reliably at peak performance, while demonstrating Taiwan's strength in advanced materials and engineering integration.</p>
<div class="lb-trans"><p>T-Global 始终致力于推动热管理创新，提供结合性能、稳定性和可靠性的综合解决方案。展望未来，公司将继续与全球合作伙伴合作，开发更高效、节能的冷却技术，使下一代计算系统能够在峰值性能下可靠运行，同时展示台湾在先进材料和工程整合方面的实力。</p>
</div><p>Photo - https://mma.prnewswire.com/media/2977897/02_2.jpg</p>
<div class="lb-trans"><p>照片 - https://mma.prnewswire.com/media/2977897/02_2.jpg</p>
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06:18 ETT-Global Technology Partners with France's SiPearl to Advance Next-Generation HPC Cooling Technologies

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06:18 ETT-Global Technology 与法国 SiPearl 合作以推进下一代高性能计算冷却技术