<p>/PRNewswire/ -- NewPhotonics Ltd 今日推出了業界首款 NPG10240 3.2Tbps PIC，配備 448Gbps 調制解調器、集成激光器和 OSPic™ 光信號處理器。該產品旨在為下一代 AI 基礎設施提供服務，激光集成信號均衡引擎提供高密度 400G/通道連接，具有更高的能效和簡化的設計，適用於可插拔和高密度近封裝光學（NPO）架構。</p>
<p><img src="https://imageproxy.pbkrs.com/https://mma.prnewswire.com/media/2859143/NewPhotonics_New_Logo.jpg?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" width="400" height="89" original-src="https://imageproxy.pbkrs.com/https://mma.prnewswire.com/media/2859143/NewPhotonics_New_Logo.jpg"/></p>
<p>翻轉芯片八通道發射器將激光源、高速調制解調器和可編程光均衡集成在一個緊湊的引擎中，支持 3.2Tbps DR8 連接的超大規模部署。通過在光學領域處理電氣損傷，專有的 OSPic 引擎減少了射頻設計限制，增強了信號完整性，並在每個通道 448Gbps 的情況下實現了更一致的鏈路性能。</p>
<p>“AI 集羣正在迅速推動向更高速光互連的過渡，行業正在從 800G 和 1.6T 邁向下一個擴展階段的 3.2T，” LightCounting 創始人 Vlad Kozlov 説。“高度集成的光子引擎結合了激光器、調制解調器和先進的信號調理，將在實現更高數據速率的同時保持能效和製造可擴展性方面發揮重要作用。”</p>
<p>NPG10240 的主要特點和優勢包括：</p>
<ul>
<li>緊湊、高度集成的 3.2T 引擎，針對可插拔和高密度 NPO 架構進行了優化。</li>
<li>OSPic 光學域均衡，緩解電氣射頻損傷，放寬射頻設計限制，同時改善信號完整性和整體鏈路性能。</li>
<li>異構激光集成，減少光耦合損失，最小化外部組件需求，提高整體系統能效。</li>
<li>翻轉芯片封裝，簡化系統組裝，提高 OEM 製造良率，改善長期收發器可靠性。</li>
</ul>
<p>“比帶寬擴展更重要的是 AI 工廠對可擴展光集成的需求，以在更高的製造效率下提供更低的功耗，” NewPhotonics 光連接高級副總裁兼總經理 Doron Tal 説。“我們的 3.2Tbps 級光學解決方案消除了在最苛刻架構中部署 448G/通道光學的關鍵障礙。”</p>
<p>NewPhotonics 的芯片上發射器採樣計劃，提供 3.2T 解決方案，將於 2026 年第四季度推出。</p>
<p><strong>關於 NewPhotonics</strong></p>
<p>NewPhotonics® 是一家無晶圓半導體公司，提供創新的光子集成電路解決方案，以擴展超大規模和數據中心互連，提升 AI 集羣性能。該公司的激光集成 PIC 和 OSPic™ 全光信號處理實現了市場顛覆性的能效和生產簡便性，適用於 DSP 和 LPO+ 可插拔、NPO 和 CPO 芯片解決方案。NewPhotonics 成立於 2020 年，屬於私人持有並獲得資金支持。有關更多信息，請訪問 www.newphotonics.com。</p>
<p>媒體聯繫：</p>
<p>企業傳播</p>
<p>press.relations@newphotonics.com</p>
<p>+972 3 614-3147</p>
<p>Logo - https://mma.prnewswire.com/media/2859143/5856414/NewPhotonics_New_Logo.jpg</p>
<p><img src="https://imageproxy.pbkrs.com/https://edge.prnewswire.com/c/img/favicon.png/query-c2Q9MjAyNi0wMy0xMiZzbj1MTjA2ODMx?x-oss-process=image/auto-orient,1/interlace,1/resize,w_1440,h_1440/quality,q_95/format,jpg" alt="" width="16" height="16" original-src="https://imageproxy.pbkrs.com/https://edge.prnewswire.com/c/img/favicon.png/query-c2Q9MjAyNi0wMy0xMiZzbj1MTjA2ODMx"/></p>
<p>查看原始內容以下載多媒體：https://www.prnewswire.com/news-releases/newphotonics-introduces-industry-first-3-2tbps-dr8-transmitter-on-chip-pic-with-integrated-ospic-optical-signal-processor-for-ai-data-center-connectivity-302711543.html</p>
<p>來源：NewPhotonics Ltd</p>

3110

3167

2820

2638

<p>NewPhotonics 有限公司推出了 NPG10240，這是首款集成 OSPIC™光信號處理器的 3.2Tbps 芯片級發射器，旨在增強人工智能數據中心的連接性。該緊湊型引擎配備 448Gbps 調制解調器和激光集成，提高了能效並簡化了高密度架構的設計。OSPIC 引擎增強了信號完整性和性能，響應了行業向更高速光互連的轉變。該創新解決方案的採樣計劃將在 2026 年第四季度推出，標誌着光集成在人工智能基礎設施中的重要進展</p>

<p>, /PRNewswire/ -- NewPhotonics Ltd, today unveiled the industry first NPG10240 3.2Tbps PIC with 448Gbps modulators, integrated lasers and OSPic™ optical signal processor. Designed for next-generation AI infrastructure, the laser-integrated signal equalization engine delivers high-density 400G/lane connectivity with improved power efficiency and simplified design for pluggable and high density near-package optics (NPO) architectures.</p>
<div class="lb-trans"><p>/PRNewswire/ -- NewPhotonics Ltd 今日推出了業界首款 NPG10240 3.2Tbps PIC，配備 448Gbps 調制解調器、集成激光器和 OSPic™ 光信號處理器。該產品旨在為下一代 AI 基礎設施提供服務，激光集成信號均衡引擎提供高密度 400G/通道連接，具有更高的能效和簡化的設計，適用於可插拔和高密度近封裝光學（NPO）架構。</p>
</div><p><img src="https://imageproxy.pbkrs.com/https://mma.prnewswire.com/media/2859143/NewPhotonics_New_Logo.jpg" alt="" original-src="https://mma.prnewswire.com/media/2859143/NewPhotonics_New_Logo.jpg"/></p>
<p>The flip-chip octal-channel transmitter integrates laser sources, high-speed modulators, and programmable optical equalization in a compact engine for hyperscale deployment at 3.2Tbps DR8 connectivity. By processing electrical impairments in the optical domain, the proprietary OSPic engine reduces RF design constraints, enhances signal integrity, and enables more consistent link performance at 448Gbps per lane.</p>
<div class="lb-trans"><p>翻轉芯片八通道發射器將激光源、高速調制解調器和可編程光均衡集成在一個緊湊的引擎中，支持 3.2Tbps DR8 連接的超大規模部署。通過在光學領域處理電氣損傷，專有的 OSPic 引擎減少了射頻設計限制，增強了信號完整性，並在每個通道 448Gbps 的情況下實現了更一致的鏈路性能。</p>
</div><p>&#34;AI clusters are rapidly driving the transition to higher-speed optical interconnects, with the industry moving from 800G and 1.6T to 3.2T in the next phase of scaling,&#34; said Vlad Kozlov, Founder, LightCounting. &#34;Highly integrated photonic engines that combine lasers, modulators and advanced signal conditioning will play an important role in enabling these higher data rates while maintaining power efficiency and manufacturing scalability.&#34;</p>
<div class="lb-trans"><p>“AI 集羣正在迅速推動向更高速光互連的過渡，行業正在從 800G 和 1.6T 邁向下一個擴展階段的 3.2T，” LightCounting 創始人 Vlad Kozlov 説。“高度集成的光子引擎結合了激光器、調制解調器和先進的信號調理，將在實現更高數據速率的同時保持能效和製造可擴展性方面發揮重要作用。”</p>
</div><p>Key features and benefits of the NPG10240 include:</p>
<div class="lb-trans"><p>NPG10240 的主要特點和優勢包括：</p>
</div><ul>
<li>Compact, highly integrated 3.2T engine optimized for pluggable and high-density NPO architectures.</li>
<li>OSPic optical domain equalization mitigating electrical RF impairments to relax RF design constraints while improving signal integrity and overall link performance.</li>
<li>Heterogeneously laser integration that reduces optical coupling losses, minimizes external component requirements and improves overall system power efficiency.</li>
<li>Flip-chip packaging for simplified system assembly that enhances OEM manufacturing yield and improves long-term transceiver reliability.</li>
</ul>
<div class="lb-trans"><ul>
<li>緊湊、高度集成的 3.2T 引擎，針對可插拔和高密度 NPO 架構進行了優化。</li>
<li>OSPic 光學域均衡，緩解電氣射頻損傷，放寬射頻設計限制，同時改善信號完整性和整體鏈路性能。</li>
<li>異構激光集成，減少光耦合損失，最小化外部組件需求，提高整體系統能效。</li>
<li>翻轉芯片封裝，簡化系統組裝，提高 OEM 製造良率，改善長期收發器可靠性。</li>
</ul>
</div><p>&#34;More important than bandwidth expansion is the AI factory requirement for scalable optical integration delivering lower power at higher manufacturing efficiency,&#34; said Doron Tal, SVP and GM of Optical Connectivity at NewPhotonics. &#34;Our 3.2Tbps class optical solution removes key barriers to deploying 448G/lane optics across the most demanding architectures.&#34;</p>
<div class="lb-trans"><p>“比帶寬擴展更重要的是 AI 工廠對可擴展光集成的需求，以在更高的製造效率下提供更低的功耗，” NewPhotonics 光連接高級副總裁兼總經理 Doron Tal 説。“我們的 3.2Tbps 級光學解決方案消除了在最苛刻架構中部署 448G/通道光學的關鍵障礙。”</p>
</div><p>The NewPhotonics transmitter-on-chip sampling program featuring 3.2T solutions will be available in Q4 2026.</p>
<div class="lb-trans"><p>NewPhotonics 的芯片上發射器採樣計劃，提供 3.2T 解決方案，將於 2026 年第四季度推出。</p>
</div><p><strong>About NewPhotonics</strong></p>
<div class="lb-trans"><p><strong>關於 NewPhotonics</strong></p>
</div><p>NewPhotonics® is a fabless semiconductor company delivering innovative photonic IC solutions that scale hyperscaler and data center interconnect for AI cluster performance. The company's laser-integrated PICs and OSPic™ all-optical signal processing enable market-disrupting energy efficiency and production simplicity for DSP and LPO+ pluggable, NPO, and CPO chip solutions. Founded in 2020, NewPhotonics is privately held and funded. For more information, visit www.newphotonics.com.</p>
<div class="lb-trans"><p>NewPhotonics® 是一家無晶圓半導體公司，提供創新的光子集成電路解決方案，以擴展超大規模和數據中心互連，提升 AI 集羣性能。該公司的激光集成 PIC 和 OSPic™ 全光信號處理實現了市場顛覆性的能效和生產簡便性，適用於 DSP 和 LPO+ 可插拔、NPO 和 CPO 芯片解決方案。NewPhotonics 成立於 2020 年，屬於私人持有並獲得資金支持。有關更多信息，請訪問 www.newphotonics.com。</p>
</div><p>Press Contact:</p>
<div class="lb-trans"><p>媒體聯繫：</p>
</div><p>Corporate Communications</p>
<div class="lb-trans"><p>企業傳播</p>
</div><p>press.relations@newphotonics.com</p>
<div class="lb-trans"><p>press.relations@newphotonics.com</p>
</div><p>+972 3 614-3147</p>
<div class="lb-trans"><p>+972 3 614-3147</p>
</div><p>Logo - https://mma.prnewswire.com/media/2859143/5856414/NewPhotonics_New_Logo.jpg</p>
<div class="lb-trans"><p>Logo - https://mma.prnewswire.com/media/2859143/5856414/NewPhotonics_New_Logo.jpg</p>
</div><p><img src="https://imageproxy.pbkrs.com/https://edge.prnewswire.com/c/img/favicon.png/query-c2Q9MjAyNi0wMy0xMiZzbj1MTjA2ODMx" alt="" original-src="https://edge.prnewswire.com/c/img/favicon.png?sn=LN06831&amp;sd=2026-03-12"/></p>
<p>View original content to download multimedia:https://www.prnewswire.com/news-releases/newphotonics-introduces-industry-first-3-2tbps-dr8-transmitter-on-chip-pic-with-integrated-ospic-optical-signal-processor-for-ai-data-center-connectivity-302711543.html</p>
<div class="lb-trans"><p>查看原始內容以下載多媒體：https://www.prnewswire.com/news-releases/newphotonics-introduces-industry-first-3-2tbps-dr8-transmitter-on-chip-pic-with-integrated-ospic-optical-signal-processor-for-ai-data-center-connectivity-302711543.html</p>
</div><p>SOURCE NewPhotonics Ltd</p>
<div class="lb-trans"><p>來源：NewPhotonics Ltd</p>
</div>

NewPhotonicsÂ® Introduces Industry First 3.2Tbps DR8 Transmitter-on-Chip PIC with Integrated OSPicâ¢ Optical Signal Processor for AI Data Center Connectivity

NewPhotonics® 推出業界首款 3.2Tbps DR8 芯片級發射器 PIC，集成了 OSPic™光信號處理器，專為 AI 數據中心連接而設計