Some updates on bottleneck timelines:
- ABF substrates: 1 year / eg. Ajinomoto (2802) for ABF film, Ibiden, Unimicron, Nan Ya PCB, etc make the substrates - HDI Boards: Over 6 months / Victory Giant (300476), Zhen Ding (4958), Unimicron, Compeq (2313), Meiko (6787)- Multilayer boards: ~6 months / Victory Giant, WUS (002463), $TTM Tech(TTMI.US), Gold Circuit Electronics (2368), - CCL: Over 6 months (severe shortages of materials) / Elite Material (2383), Shengyi (600183), TUC (6274), ITEQ (6213), Nan Ya Plastics (1303), Resonac (4004)Mitsui Kinzoku (5706) / HVLP copper foil. Nittobo / glass fiber/cloth- MLCCs, chip resistors, tantalum capacitors, aluminum electrolytic capacitors: 15-20 weeks to 1 year+MLCC: Murata (6981), Samsung Electro-Mechanics, TDK (6762), Taiyo Yuden (6976), Yageo (2327), Walsin (2492)Chip Resistors: Yageo, Walsin, KOA (6999), Rohm (6963) and $Vishay Intertech(VSH.US)Tantalum capacitors: Kyocera/AVX, Yageo/KEMET, $Vishay Intertech(VSH.US) againAluminum electrolytic capacitors: Nippon Chemi-Con (6997) Nichicon (6996) | Timelines sourced from Digitimes, did the honors of adding in related companies. But it's slightly more nuanced since MLCCs and others mix. in commodity types vs. AI DCs.Regardless, just some helpful mapping.D
![AI]()
![Metric/Protocols NVLink 5.0 NVLink 6.0 UALink1.0 UALoE Bandwidth per lane/ link]()
![Figure 1： Total AI/ML Networking Market Other (PCIe， UALink， 一sco兰云凹u3cu>u& Othe]()
![AMD MI300X Intra-tray Connectivity AMDMI300X INFINITY PLATFORM" 8x AMD Instinct"]()
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AMD vs. NVDA: Can Helios Measure Up?
In the market for commercially sold GPUs, competition is essentially a two-horse race between $NVIDIA(NVDA.US) and $AMD(AMD.US). In the MI300 era, AMD captured little of the AI compute upside due to the lack of a system-level solution, with interconnects at its core.
Now Helios is here. That raises two questions: 1) does AMD truly have the capability to go head-to-head with NVIDIA, and 2) as interconnect schemes compete and iterate, how will supply-chain dynamics shift, who benefits, and who loses? We will examine these issues through the lens of interconnect.Deep Research