Some updates on bottleneck timelines:
- ABF substrates: 1 year / eg. Ajinomoto (2802) for ABF film, Ibiden, Unimicron, Nan Ya PCB, etc make the substrates - HDI Boards: Over 6 months / Victory Giant (300476), Zhen Ding (4958), Unimicron, Compeq (2313), Meiko (6787)- Multilayer boards: ~6 months / Victory Giant, WUS (002463), $TTM Tech(TTMI.US), Gold Circuit Electronics (2368), - CCL: Over 6 months (severe shortages of materials) / Elite Material (2383), Shengyi (600183), TUC (6274), ITEQ (6213), Nan Ya Plastics (1303), Resonac (4004)Mitsui Kinzoku (5706) / HVLP copper foil. Nittobo / glass fiber/cloth- MLCCs, chip resistors, tantalum capacitors, aluminum electrolytic capacitors: 15-20 weeks to 1 year+MLCC: Murata (6981), Samsung Electro-Mechanics, TDK (6762), Taiyo Yuden (6976), Yageo (2327), Walsin (2492)Chip Resistors: Yageo, Walsin, KOA (6999), Rohm (6963) and $Vishay Intertech(VSH.US)Tantalum capacitors: Kyocera/AVX, Yageo/KEMET, $Vishay Intertech(VSH.US) againAluminum electrolytic capacitors: Nippon Chemi-Con (6997) Nichicon (6996) | Timelines sourced from Digitimes, did the honors of adding in related companies. But it's slightly more nuanced since MLCCs and others mix. in commodity types vs. AI DCs.Regardless, just some helpful mapping.
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