SEMI launches chip materials alliance
Taipei Times·
Fabrinet, IQIYI, Hesai Group And Other Big Stocks Moving Lower In Tuesday’s Pre-Market Session
benzinga_article·- U.S. stock futures declined in Tuesday's pre-market session, with Nasdaq 100 futures falling around 1 %. - Fabrinet shares dropped 9.1 % to $544.06 after issuing a first-quarter GAAP EPS outlook of $3.39 to $3.54, which missed market estimates, despite beating fourth-quarter earnings and sales expectations. - Several other stocks, including IQIYI, Hesai Group, and AXT, also moved lower following recent financial results or previous session gains.SPIL breaks ground in Yunlin
Taipei Times·Weekly Recap: 3nm/2nm wafer ramps >260k/mo and raised guidance on 2027 AI
TradingView·- Taiwan Semiconductor Manufacturing Co., Ltd. raised its guidance and capex alongside clearer multi‑year AI demand visibility. - Combined 3nm and 2nm wafer starts are projected to exceed 260k per month, while CoWoS packaging steps are outsourced to ease capacity limits. - The company also resumed full output at its Kumamoto fab and entered full production for AMD Venice CPUs.TSMC Expands CoW Packaging Outsourcing as Hanmi Semiconductor and Other Equipment Makers Set to Benefit First
TradingKey·- TSMC is extensively outsourcing the Chip on Wafer packaging process to external partners like ASE to alleviate critical AI chip supply bottlenecks. - This shift is driven by surging global demand for AI chips from companies like Nvidia and custom chip developers that outpaces internal packaging expansion. - The outsourcing expansion will directly benefit back-end semiconductor equipment suppliers, such as South Korea's Hanmi Semiconductor, through a surge in equipment procurement.TSMC Shares Rise Nearly 3% Pre-Market as It Expands Outsourced Packaging to Meet Nvidia AI Chip Demand Amid Capacity Constraints
TradingKey·- TSMC's US-listed shares rose nearly 3 % in pre-market trading as surging AI chip demand from Nvidia and AMD kept its CoWoS advanced packaging capacity near full load. - To ease supply bottlenecks for accelerators like the Blackwell series, TSMC is expanding its own production lines and increasing outsourced capacity through partners such as ASE Technology Holding and SPIL. - This capacity expansion in high-margin advanced packaging is expected to enhance supply capabilities and serve as a key driver of future revenue growth.ASE raises capital spending by 23.5%
Taipei Times·