Advanced Semiconductor Engineering

Taiwan’s July export orders rose 61.9% year-on-year to a fresh record high US$97.94 billion and beating the expected 52.7% increase, media report. The US led all others with orders up 88.9% to $40.79B, the fastest pace of growth ever. Orders for IT/communications products, including servers & networking gear, rose 89.5% to $33.27B on strong AI and cloud service demand, while Electronics Products, including semiconductors and chip manufacturing services, rose 71.7% to $41.32 billion. In August, officials see export orders nearing $100B, up 61.4% - 64.8%. $Taiwan Semiconductor(TSM.US) $United Microelectronics(UMC.US) $Advanced Semiconductor Engineering(ASX.US) #Foxconn #Quanta #Wistron

Source: Dan Nystedt

Rumor: Intel Malaysia took over some advanced packaging for TSMC due to a surge in orders for CoWoS packaging by a major mutual client, media report, adding ASE, Unimicron, Gudeng Precision and others are also expected to benefit from the move. TSMC is expected to ship more advanced chips as the packaging bottleneck eases. $Intel(INTC.US) $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) $Alphabet(GOOGL.US) $NVIDIA(NVDA.US) #semiconductors

Source: Dan Nystedt

When Nvidia announced Spectrum-X switches built with CPO (co-packaged optics) have entered mass production, it named 4 Taiwan firms among partners, TSMC, Foxconn, ASE and Browave as well as China’s leading optics firm, TFC Communication, media report, and multiple firms say their order books are already full through 2027 and expect supplies to be tight into 2028.

Source: Dan Nystedt

Siliconware Precision (SPIL) broke ground Tuesday on an NT$100 billion (US$3.1B) CoWoS advanced packaging plant in Douliu, central Taiwan, aimed at massive AI-related demand, media report, adding SPIL’s new plant investments in the past 2-years total NT$200 billion. SPIL is a key Nvidia packaging partner. TSMC outsources some parts of CoWoS work to the group SPIL is part of, ASE Holding. TSMC will also certify ‘copy exact’ partners, which SPIL’s facilities are designed to match. $Advanced Semiconductor Engineering(ASX.US) $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) #semiconductors

Source: Dan Nystedt

🚨 $Advanced Semiconductor Engineering(ASX.US) JULY '26 ATM REVENUE🚨

Source: Chips & Wafers

$Advanced Semiconductor Engineering(ASX.US) filed ~$160M of equipment POs in the last 48hrs:

Source: Chips & Wafers

ABF substrate makers are being forced to move faster on expansion plans as AI chip die get bigger, driving demand for larger substrates, media report, noting long term agreements (LTAs) are no longer enough: clients are paying firms to launch 2029-2030 expansion plans now, using a variety of methods:

Source: Dan Nystedt

AUO, the display panel maker, plans to spend NT$8.64 billion (US$267M) for an FOPLP advanced chip packaging pilot line that uses glass substrates: Glass Core (structure), Redistribution Layer (RDL, fine metal wiring) and Through Glass Via (TGV, tiny holes drilled through the glass to connect layers). FOPLP plans aim at LEO satellite antennas, Micro LEDs and optical communications. AUO’s main rival in Taiwan, Innolux, has already started developing its advanced semiconductor packaging business. In February, AUO’s board approved NT$14.67B in capex spending. $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) #advancedpackaging #semiconductors

Source: Dan Nystedt

ASE, the chip packaging giant, raised its 2026 capex to an estimated US$10.5 billion from $8.5 billion amid strong demand for advanced and general packaging, its 2nd capex increase so far this year, media report, adding the figure is based on analyst estimates. It would be the biggest spend in ASE’s history. Capex spending is expected to be split evenly between plants and equipment. Note that ASE sees glass substrates and silicon photonics as keys to overcoming hardware bottlenecks, so will likely figure into the capex spend.

Source: Dan Nystedt

ATE PURCHASE ALERT $Advanced Semiconductor Engineering(ASX.US) <> ADVANTEST

Source: Chips & Wafers

Taiwan’s semiconductor industry will account for 24.34% of Taiwan’s total power consumption in 2030, up from 17.71% this year, media report, citing state-run Taipower. That means 80 billion kWh by 2030, from 52 billion kWh this year. By 2035, the semiconductor industry’s power use will hit 110 billion kWh, or 30.38% of Taiwan’s electricity. TSMC, the biggest chip maker in Taiwan, operates 19 advanced fabs and packaging plants in Taiwan now, with 13 more under construction across Taiwan. $Taiwan Semiconductor(TSM.US) $United Microelectronics(UMC.US) $Micron Tech(MU.US) $Advanced Semiconductor Engineering(ASX.US) #semiconductors

Source: Dan Nystedt

TSMC and other high energy users may soon see costs rise: Taiwan lawmakers will on Wednesday (7/22) review a proposal to require major electricity consumers (TSMC is the biggest) to install their own power supply for 5MW or more power contracts, media report, noting around 400 companies in semiconductors, AI data centers, optoelectronics, and more will be affected. The idea is to avoid straining Taiwan’s power grid. $Taiwan Semiconductor(TSM.US) $United Microelectronics(UMC.US) $Advanced Semiconductor Engineering(ASX.US) $Bloom Energy(BE.US) $GE Aerospace(GE.US) #semiconductors

Source: Dan Nystedt

ASE Technology’s 2nd quarter revenue rose to a record high NT$191.06 billion (US$5.95B), up 26.7% year-on-year due to strong AI-related sales, media report. The chip packaging and testing giant reported June revenue rose 32.9% to NT$65.78 billion, its 2nd best month ever. $Advanced Semiconductor Engineering(ASX.US) $NVIDIA(NVDA.US) $AMD(AMD.US) $Amkor Tech(AMKR.US) #semiconductors

Source: Dan Nystedt

Taiwan’s semiconductor exports in June rose 33.4% year-on-year to US$24.11 billion, raising 2nd quarter chip exports to $71.15B, up 43.7%, media report.

Source: Dan Nystedt

Just some of the more interesting news I came across recently:1. MS: Revised China humanoid shipments to reach 50,000 in 2026 from 14,000u and 28,000u earlier this year.2. MS: Probe cards and test sockets likely to be priced hike (precious metal hikes + severe shortage of test pin capacity) 3. Capacitor price hikes: MLCC, aluminum electrolytic, tantalum, polymer aluminum, film, and super capacitors from Yageo.4. $Meta Platforms(META.US) Vistara architecture: Older DDR4 Memory with CXL as memory expansion5. OpenAI achieved inference optimization breakthrough that halves costs and reduces GPU requirements. 6. LTAs are being signed with MLCC after Samsung signed LTA with US big tech customer7. Grid power bottlenecks triggered 5x increase ($25B) in Brookfield's financing for $Bloom Energy(BE.US) fuel cells. 8. Taiwan's chip packaging and testing supply chain includes major OSAT providers such as $Advanced Semiconductor Engineering(ASX.US), Powertech, Winstek Semiconductor, Chipbond, ChipMOS, and ShunSin. Dedicated testing companies include KYEC, Ardentec, and Sigurd Microelectronics, while testing interface suppliers include WinWay, MPI, Keystone Microtech, Chunghwa Precision, and Hermes Testing Solutions. Leadframe makers include Jih Lin Tech, SDI, and CWTC, while major IC substrate suppliers include Unimicron, Kinsus, Nan Ya PCB, and Zhen Ding Tech. (Digitimes) - Taiwan-based OSAT providers are raising prices- Memory and IC packaging and testing capacity have both become bottlenecks in the semiconductor supply chain

ASE’s advanced semiconductor packaging & testing revenue will double this year amid severe capacity shortages due to AI-related orders, and its US$8.5 billion capex forecast for 2026 “will likely need to be revised up again,” said COO Tien Wu, media report, adding ASE is evaluating price hikes. ASE now has 15 plants under construction, and plans to build 2 more in the US, adding to the 2 already there. 1/2 $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) #semiconductors

Source: Dan Nystedt

$Advanced Semiconductor Engineering(ASX.US) confirming orders of ~$63M from $Camtek(CAMT.US) & ~$39M from $ASMPT.

Source: Chips & Wafers

$AMD(AMD.US) in the 52 week high list. Names in the list for today right now with volume over 750k and price over $5

Source: Sunrise Trader

ASE, the chip packaging & testing giant, has spent NT$62.08 billion (US$1.96B) on production line equipment so far in June alone to meet booming demand, media report, with the biggest spend by subsidiary SPIL, NT$59.42 billion. Nvidia is a key client of SPIL's.

Source: Dan Nystedt

Taiwan forecasts its annual electricity demand will grow 2.5% per year from 2026 to 2035 to meet the needs of AI data centers and its booming semiconductor industry, media report, up from 1.2% average growth over the past decade. Media note the 2.5% projection is lower than the 2024 forecast of 2.8% for 2026-2035, and highlights Nvidia CEO Jensen Huang saying more than once during his recent visit: “Taiwan needs more power.”

Source: Dan Nystedt