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AI GossipOct 21, 2026 at 01:45 AM
Substrate shortages will remain in 2027 due to shortages of materials and production machinery, said Unimicron Chairman Shan-Chieh Chien, media report. Equipment lead times have lengthened “significantly” and certain equipment now take 30 months for delivery. Lead times for over 80% of equipment have lengthened as everyone builds new plants. In materials, shortages have been ongoing for nearly 2-years, and the company continues to monitor them (ABF, T-glass, CCL). Substrates are a key component for advanced semiconductor packaging. $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) #semiconductors
Source: Dan Nystedt
Advanced Semiconductor Engineering
USASX
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AI GossipOct 12, 2026 at 01:55 AM
Prices for advanced semiconductor testing are set to rise 10% - 30% as supply falls far short of demand, media report, calling upcoming price increases ‘the strongest in history.’ Chip testing times continue to lengthen as chips become more complex and demand booms as Cloud giants launch their own AI chips. Testing prices for rush orders for smaller clients have doubled, the report says, adding that ASE, KYEC, PTI and Ardentec are all benefitting from stronger pricing. $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) $Teradyne(TER.US) $Formfactor(FORM.US) $Cohu(COHU.US) #BESI #Advantest #TokyoElectron #ChromaATE
Source: Dan Nystedt
Advanced Semiconductor Engineering
USASX
A
AI GossipOct 8, 2026 at 09:55 PM
Taiwan's semiconductor exports in September rose 46.1% year-on-year to US$29.74 billion, raising January thru September to $220.0B, up 47.3%, and leading Taiwan exports to an all-time high for a single month in September.
Overall exports rose 60.9% to $87.22 billion, led by expanding AI-related business opportunities and strong sales in the traditional peak season for technology goods, media report, while imports also hit a record high, rising 51.7% to $63.59 billion.
IT and Audio/visual exports rose 103% to $39.13 billion, a category that includes AI servers, general servers, PCs, and graphics cards, while electronics component exports, including semiconductors, rose 45.3% to $31.13B $Taiwan Semiconductor(TSM.US) $United Microelectronics(UMC.US) $Advanced Semiconductor Engineering(ASX.US)
Source: Dan Nystedt
Advanced Semiconductor Engineering
USASX
E
Equity researchSep 29, 2026 at 02:15 PM
UBS: Nvidia's CPO suppliers
$NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) $Teradyne(TER.US) $Advanced Semiconductor Engineering(ASX.US)
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AI GossipSep 7, 2026 at 07:56 AM
Below is a summary from an article by Calvin Lee, Director of Corporate R&D of ASE who is leading 3D IC packaging development.
For investors, the key point is that microbumps have a surprisingly long runway as packaging complexity increases. Their ability to scale within existing backend manufacturing flows makes them a lower-risk path for expanding advanced packaging capacity, while hybrid bonding remains concentrated in applications where its incremental performance justifies the substantially higher manufacturing requirements....
'Microbumps and Hybrid Bonding both enable high-density die-to-die and die-to-wafer integration, but they impose very different requirements on the manufacturing process. Those differences are important because they help explain why microbumps remain the preferred solution for high-volume production today.
👉Manufacturing maturity:
Microbump processing builds on manufacturing infrastructure that OSATs and foundries already have in place: electroplating, resist patterning, UBM formation and reflow. The key challenge is continuing to push toward finer pitches, with 40–100µm already established and 20µm becoming an important target. This is largely an extension of existing processes rather than a fundamental change in the manufacturing environment.
Hybrid bonding requires a much tighter process flow. Surface preparation, CMP, plasma activation, contamination control and sub-micron alignment all become critical. In practice, this introduces more frontend-like process requirements into the packaging flow, increasing both capital intensity and process complexity. That makes hybrid bonding considerably more difficult to deploy across a broad manufacturing base.
👉Supply chain and process control:
The microbump ecosystem is mature. Copper, nickel, solder alloys, UBM materials and the associated equipment are available from a broad supplier base, and the process is sufficiently tolerant to support multisourcing and production across different facilities.
Hybrid bonding is more sensitive to relatively small variations in surface roughness, wafer flatness, oxide properties, contamination and bonding conditions. As a result, process recipes and equipment become more tightly coupled, making qualification, second sourcing and transferring production between sites more difficult. For an investor, this matters because it can translate into longer qualification cycles, higher switching costs and greater execution risk during capacity expansion.
👉Alignment and yield:
Microbumps also have a fundamental advantage in process tolerance. The solder-based connection provides some mechanical compliance during assembly and reflow, helping absorb modest alignment errors, wafer bow and thermal mismatch. That becomes increasingly valuable as package dimensions increase and heterogeneous dies are combined.
Hybrid bonding removes much of that tolerance in exchange for substantially higher interconnect density. Direct copper-to-copper or oxide-to-oxide bonding requires extremely tight control of alignment and surface condition. Defects that would be tolerated in a conventional microbump flow can instead become yield limiters. The result is a narrower process window and a more demanding yield-learning curve, particularly as die sizes and stack heights increase.
👉The OSAT perspective:
This is where the distinction becomes particularly important. Microbumps already provide the density, bandwidth and power characteristics required for chiplets, HBM and large 2.5D packages, while remaining compatible with established backend processes such as RDL formation, known-good-die assembly and chip-on-wafer bonding.
The technology is also continuing to scale. VIPack, for example, is targeting a progression from roughly 40µm toward 20µm pitch through improvements in the metallurgical stack rather than a wholesale change in the packaging architecture.
Hybrid bonding will increasingly matter where interconnect density and electrical performance justify the additional process complexity, particularly for demanding 3D logic and future memory architectures. But for much of the market, microbumps offer a compelling trade-off: sufficient interconnect density, a mature equipment and materials ecosystem, broader manufacturing flexibility and a more forgiving yield profile.'
Source: Chips & Wafers
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AI GossipAug 30, 2026 at 10:56 PM
Strong demand for Google Tensor Processing Units (TPUs), Intel outsourcing more as it focuses on EMIB, and price increases due to rising costs and demand are all converging into a boom of advanced packaging and testing orders for ASE Technology, media report, adding Google has aggressively expanded TPU volume via partners including Broadcom, MediaTek, Marvell and AMD, leading to substantial add-on orders at ASE. Estimates put Google TPU shipments at 12 to 15 million units by 2028. TSMC remains Google’s chip fabrication and CoWoS partner, with ASE also a major winner from the TPU ramp up. $Advanced Semiconductor Engineering(ASX.US) $Alphabet(GOOGL.US) $Intel(INTC.US) #semiconductors
Source: Dan Nystedt
Advanced Semiconductor Engineering
USASX
A
AI GossipAug 21, 2026 at 01:56 AM
Taiwan’s July export orders rose 61.9% year-on-year to a fresh record high US$97.94 billion and beating the expected 52.7% increase, media report. The US led all others with orders up 88.9% to $40.79B, the fastest pace of growth ever. Orders for IT/communications products, including servers & networking gear, rose 89.5% to $33.27B on strong AI and cloud service demand, while Electronics Products, including semiconductors and chip manufacturing services, rose 71.7% to $41.32 billion. In August, officials see export orders nearing $100B, up 61.4% - 64.8%. $Taiwan Semiconductor(TSM.US) $United Microelectronics(UMC.US) $Advanced Semiconductor Engineering(ASX.US) #Foxconn #Quanta #Wistron
Source: Dan Nystedt
Advanced Semiconductor Engineering
USASX
A
AI GossipAug 19, 2026 at 02:46 AM
Rumor: Intel Malaysia took over some advanced packaging for TSMC due to a surge in orders for CoWoS packaging by a major mutual client, media report, adding ASE, Unimicron, Gudeng Precision and others are also expected to benefit from the move. TSMC is expected to ship more advanced chips as the packaging bottleneck eases. $Intel(INTC.US) $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) $Alphabet(GOOGL.US) $NVIDIA(NVDA.US) #semiconductors
Source: Dan Nystedt
Advanced Semiconductor Engineering
USASX
A
AI GossipAug 18, 2026 at 12:26 AM
When Nvidia announced Spectrum-X switches built with CPO (co-packaged optics) have entered mass production, it named 4 Taiwan firms among partners, TSMC, Foxconn, ASE and Browave as well as China’s leading optics firm, TFC Communication, media report, and multiple firms say their order books are already full through 2027 and expect supplies to be tight into 2028.
CoreWeave, Lambda and Oracle will become the first to deploy the 200Gbps/lane CPO Ethernet switch system, billed for a big leap in performance:
5x improvement in network power efficiency
5x increase in continuous AI uptime
10x extension in Mean Time Between Failures (MTBF)
Up to 1.6x overall AI network performance boost, supports 100s of 1000s of GPUs
TSMC and Foxconn are expected to play key roles, with TSMC leading production via its COUPE silicon photonics engine platform, which integrates components that are then packaged by ASE and use Browave’s optical components. Foxconn does final assembly of the CPO switches.
Foxconn Chairman Young Liu has said CPO switch shipment volumes will reach 10,000 units this year, with 2027 shipments multiplying several times over.
Taiwan’s FOCI and ShunSin have secured key niches in the supply chain, with FOCI’s expertise in Fiber Array Units (FAU) and ShunSin’s advanced packaging mass production prowess, media say, calling them key winners further down the supply chain. $NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) $Oracle(ORCL.US) $Coreweave(CRWV.US)
Source: Dan Nystedt
Advanced Semiconductor Engineering
USASX
A
AI GossipAug 12, 2026 at 12:46 AM
Siliconware Precision (SPIL) broke ground Tuesday on an NT$100 billion (US$3.1B) CoWoS advanced packaging plant in Douliu, central Taiwan, aimed at massive AI-related demand, media report, adding SPIL’s new plant investments in the past 2-years total NT$200 billion. SPIL is a key Nvidia packaging partner. TSMC outsources some parts of CoWoS work to the group SPIL is part of, ASE Holding. TSMC will also certify ‘copy exact’ partners, which SPIL’s facilities are designed to match. $Advanced Semiconductor Engineering(ASX.US) $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) #semiconductors
Source: Dan Nystedt
Advanced Semiconductor Engineering
USASX