"TSMC’s chip packaging (CoWoS) expansion plans for '25/'26 have slowed compared to previous projections (from 80k/120k down to 70k/110k)"
This assumes slower '25 growth, but no change to '26 estimates.But, if yields continue to improve, the '26 estimates will eventually come down as well.https://t.co/s9xdQhlbPvSource: Chips & Wafers
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