SK Hynix has delivered the world’s first 12-layer HBM4 samples to key customers ahead of schedule, it said, touting the AI memory chip’s “ultra-high performance.” Mass production is set for the second half of 2025. HBM4 offers over 2TB/s bandwidth—60% faster than HBM3e—with a 36GB capacity per 12-high stack. $NVIDIA(NVDA.US) $HXSCL $AMD(AMD.US) $Broadcom(AVGO.US) $Micron Tech(MU.US) #SKhynix #Samsung #semiconductors #semiconductor https://t.co/ISJYiIo1L9
Source: Dan Nystedt
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