Love this chart from All Ring (6187).
It's not exhaustive but it helps give an idea just how far semi packaging has progressed from traditional wirebonding or FC.There are many enablers of the AI revolution, but Advanced Packaging is one of the big ones.$NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) https://t.co/RydzWFrg5RSource: Chips & Wafers
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