Micron Technology is boosting production of HBM (high bandwidth memory) chips, the AI memory chip, with fresh equipment orders for TC bonders, including 30 from South Korea’s Hanmi Semiconductor and an unknown amount from Japan’s Shinkawa, media report, noting Hanmi’s equipment can be used for more advanced HBM3e 12Hi, while Shinkawa’s equipment is for 8Hi products. The report cites unnamed industry sources. $Micron Tech(MU.US) $HXSCL $SSNLF #semiconductors #semiconductor
Source: Dan Nystedt
The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.
