Nice to see $BESI's positive comments about #HybridBonding (HB) adoption.
Couple of things to note:Positive to see $Intel(INTC.US) successfully begin production with HB integrated machines. Good sign for collaboration with $Applied Materials(AMAT.US).BESI notes orders from two Memory players, but total Asia orders ex China still look on the low side. This suggests the number of machines in these orders could be very low; like maybe 1-2 for each company. BESI should be very careful about overselling the HB HBM4 story, as my very recent channel checks indicate that the memory players are still in the evaluation stage and far from committed to HB adoption for HBM4.Further, I assume the first memory player is $Micron Tech(MU.US), but I am not sure if the second is #SKHynix or $SEC. Either way, the Koreans are both actively pursuing local suppliers for HVM.Source: Chips & Wafers
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