For those following the #Chiplet market, this is potentially a very big story.
TSMC announces TSMC’s “System on Wafer-X (SoW-X)” Technology:"SoW-X connects HBM and chips directly at the wafer level, eliminating the need for FC-BGA substrates and silicon interposers that were essential in conventional packaging processes, replacing them instead with fine-pitch wiring technology based on InFO (Integrated Fan-Out). (A large silicon wafer integrates both the substrate and interposer roles.)"The key driver to ABF substrate growth has not been growth in end-market volumes, but in the size and layer count increases of substrates required for large packages like CoWoS (see slide below).If SoW-X obviates the need for large substrates, that does just reduce the number of substrates needed, it removes the highest ASP and highest margin products substrate manufacturers have to offer. AT&S (Austria), Unimicron (Taiwan), Ibiden (Japan), Shinko(Japan), Kinsus (Taiwan), Zhen Ding (Taiwan) and Toppan (Japan) are the major global substrate manufacturers who will be impacted by this change.Regarding #GlassSubstrates, SoX-X also has potential to reduce the need for glass substrate AND glass interposer adoption.DM for a consultation with Chips & Wafers to better understand the implications.Source: Chips & Wafers
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