"#SKHynix has successfully obtained city council approval for the construction of its high bandwidth memory (#HBM) packaging plant in Indiana, USA, with a planned investment of $3.8 billion
The project faced intense local opposition during the process of changing the initially planned site, leading to concerns about potential delays in some quartersThis approval marks a significant milestone in SK Hynix’s local investment strategy, aimed at avoiding #tariff pressures from the Donald Trump administration."Source: Chips & Wafers
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