SK Hynix and Samsung Electronics both expected to adopt hybrid bonding as the advanced semiconductor packaging process for next-generation HBM (high bandwidth memory) chips, media report, with Samsung expected to start using it early next year with HBM4, while SK Hynix is likely to wait until HBM4e, the upgraded, or Enhanced version of HBM4. 1/2 $HXSCL $SSNLF #semiconductors #semiconductor
Source: Dan Nystedt
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