The future of $Taiwan Semiconductor(TSM.US) #AdvancedPackaging:
The monolithic #SoC is now replaced with a 3D stack of chips to address high-density compute requirements. #HBM memory stacks are integrated with an RDL interposer. Integrated #SiliconPhotonics will also be part of the design to improve communication bandwidth and power. Integrated voltage regulators will also help to optimize power for this type of application.Source: Chips & Wafers
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