Friendly reminder that traditional mainstream OSAT's are not big beneficiaries of AI & HPC Advanced Packaging opportunities.
It used to be that foundry and OSAT revenues moved (relatively) hand in hand, but with the advent of AI - only leading edge foundries started seeing all the AI benefits (high-ASP wafers) with the OSAT's missing out on the packaging opportunities that came with it (CoWoS happens at the foundry).$Taiwan Semiconductor(TSM.US)Source: Chips & Wafers
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