Rumor: TSMC plans to build a pilot line in 2026 for next-generation semiconductor packaging technology, CoPoS, with Nvidia the first major customer, media report. Mass production will begin in 2028 or 2029 at TSMC’s AP7 plant in Chiayi, Taiwan CoPoS (Chip-on-Panel-on-Substrate), a variant of CoWoS-L or R, is said to offer more usable space, 310x310mm, and is easier to produce, lowering costs. CoPoS is aimed at AI chips. The pilot line will be built at a plant owned by TSMC partner VisEra Technologies. 1/2 $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) #semiconductors #semiconductor
Source: Dan Nystedt
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