Nvidia Vera Rubin AI chips could roll off production lines by year end, fully packaged (complete), media report, noting they are now in TSMC fabs on 3nm (N3P) process lines, will use CoWoS-L packaging. Robin Ultra is being made for a square carrier, likely to use CoPoS advanced packaging. 1/2 $NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) #SKhynix #Semiconductors
Source: Dan Nystedt
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