Nvidia has asked Taiwan supply chain partners to work on a new liquid cooling technology, MLCP (Micro-Laminar Cold Plate), to deal with extreme heat from its next generation chip architectures, Rubin and Feynman, which are expected to use over 2,000W of power, media report. Overheating can cause an AI server to shut down. 1/2 $NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) #semiconductors #semiconductor
Source: Dan Nystedt
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