TSMC will outsource more advanced semiconductor packaging orders for the CoW part of CoWoS work in 2026 to chip packaging giants ASE, Amkor and Powertech as it strives to keep up with new orders from big US cloud firms for their custom ASIC data center chips, media report, citing unnamed sources. 1/2 $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) $Alphabet(GOOGL.US) $Amazon(AMZN.US) $NVIDIA(NVDA.US) $AMD(AMD.US) #Semiconductors
Source: Dan Nystedt
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