TSMC mass production of 2nm chips heralds a new era of chip manufacturing marked by a fundamental change in basic transistor structure to new GAA transistors – from FinFETs – that requires an upgrade of the entire manufacturing ecosystem, media report, from clean rooms with stricter specs to new production equipment, finer materials (ex. wafers that are even flatter), more complex multi-patterning, more complex bonding, etc., and is a key reason for the higher cost of a 2nm fab and why TSMC’s 2026 capex will rise to around US$50 billion. $Taiwan Semiconductor(TSM.US) $Tokyo Electron(TOELY.US) $ASML(ASML.US) $Applied Materials(AMAT.US) $Lam Research(LRCX.US) $KLA(KLAC.US) $Apple(AAPL.US) #semiconductors

Source: Dan Nystedt