TSMC is promoting 3 key technologies to advance AI data center performance: advanced production nodes focused on power-efficiency, advanced semiconductor packaging and silicon photonics, said Roger Luo, head of TSMC China, media report.
Advanced packaging: SoIC will take over from CoWoS in future because it increases connection density as much as 20-fold. AI chips need ultra-high bandwidth and low latency.Silicon Photonics: Advantages of light vs electricity for data transmission: speed, volume, power efficiency. Luo said power efficiency improves 15x, and latency is reduced to 1/20th, vital for breaking the performance ceiling in AI clusters (interconnects between AI accelerator chips). $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) #SemiconductorsSource: Dan Nystedt
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