Samsung’s 2nm process is a real threat to TSMC in smartphone chips, media report, as Samsung’s Exynos 2600 chip revealed a breakthrough FoWLP-HPB packaging technique better-able to cool chips, appealing to giants like Apple, MediaTek, Qualcomm. FoWLP-HPB: Fan-Out Wafer-Level Packaging (w/integrated) Heat Path Block $SSNLF $Taiwan Semiconductor(TSM.US) $Intel(INTC.US) $Qualcomm(QCOM.US) #mediatek #semiconductors #smartphones
Source: Dan Nystedt
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