Dramatic turn in TSMC expansion plans: Nvidia, Google AI chip orders mean TSMC will greatly expand production of CoWoS advanced packaging, the bottleneck in GPU, TPU production, media report, adding TSMC’s CoWoS capacity will exceed 140,000 wafers-per-month (wpm) by end 2026, half for Nvidia, while MediaTek seeks more than the 20Kwpm now and other ASIC clients jockey for the rest. 1/3 $NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) $Alphabet(GOOGL.US) $Broadcom(AVGO.US) #semiconductors
Source: Dan Nystedt
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