Ambitious plans for Orum Material, a small Korean company making test interface consumables.
▫️An ultrafine test socket capable of significantly improving yields of high-bandwidth memory (#HBM) has been developed for use in post-stacking inspection of DRAM dies.▫️Orum plans to enter the HBM and #LPDDR test socket markets by next year and then expand into logic chip testing for graphics processing units (#GPUs) and central processing units (#CPUs). It also aims to enter the probe card market, applying its cantilever technology to both socket-based and wafer-level testing.Source: Chips & Wafers
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