Rumored Nvidia Rubin Ultra redesign from 4-die to 2-die: Taiwan media say the supply chain is now planning for a 2-die Rubin Ultra for 2027, down from an expected 4-die in one CoWoS-L package. The original design was considered too ambitious — reaching 7.5–8x the reticle limit — raising yield and packaging concerns. The shift aims to improve feasibility while maintaining performance via board-level 2+2 configs (two separate 2-die packages mounted together on the same server board (or module). TSMC wafer starts remain unaffected due to strong AI demand. 1/2 $NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) #semiconductors #AIchips

Source: Dan Nystedt